苏州招聘

要求：

College degrees with major in microelectronics, physics, material or electrical and electronic engineering. 0 – 2 years working experience required.
Functional/Technical competency requirement:
1.Capable in package level failure analysis and environmental reliability analysis. Good knowledge and experience in physical and electrical failure analysis tools, including curve trace, X-ray, CSAM, polisher, SEM, FIB, EDX, infrared microscope etc. Best to have experience in EMMI and OBIRCH. Good knowledge and experience in environmental reliability testing including TC, HTSL, HAST, reflow and pre-condition. Prefer to have experience in characterization tools like ball shear/pull, and surface profiler.
2.Basic knowledge on reliability fundamentals and micro flip chip PBGA and BGA assembly process, or other semiconductor assembly process.
3.Proficient in English listening, writing and speaking.

工作描述：

1.Perform package level analysis of failed units from line issue or engineering study based on internal and external facilities. Identify the possible cause or issue, write report and feedback to requestor with very minimum guidance.
2.Operate environmental reliability testing for engineering and qualification purpose with very minimum guidance. Do analyses and identify the cause if failure is observed in post reliability stress ATE testing. Sumarize results and report to requestor.
3.Own the safety, SOP/WI, PM and 5S for assigned tools and areas.
4.Own or support engineer on tool installation or uninstallation and facility set up etc.
5.Train or guide junior technician.
6.Coordinate or team work with other sister laboratories.
7.Other assigned jobs.

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