苏州招聘

多个职位需求：
1、CSP封装工艺
2、CSP测试工艺
3、CSP可靠性控制

Job Description:
1) Act as project Engineer for all the new package related activities.
2) Integrated with Process / Product Engineering, Production, QRA, Final Test and Maintenance teams in the assembly problem solving.
3) Developed packages from feasibility, design, process development, qualification to mass production.
4) Improve the assembly processes for cost effectiveness.
5) Responsible for new package research and development;
6) Responsible for Wafer level marking / Wafer Sawing process study and development;
7) Responsible for new technology tracking and survey;
8) Interface with BU and Customers to support new package development / evaluation
9) Provide technical support to other package development/Production issue

Requirments:
(1) Bachelor, Master degree in Mechanical/ EE/ Automation/ Material Science, etc;
(2) 5+Yr working experience of semiconductor for process design/development or package R&D related field;
(3) Experience with NPI project as plus;
(4) Good knowledge on mechanical design/simulation(Ansys or other software), material analysis, package assembly process, package qualification method, project management;
(5) Ability to achieve results in a fast moving, dynamic environment.
(6) Good team work, willing to learn, and logical thinking;
(7) Good English communication (written and verbal) and interpersonal skills.
(8) Must be independent and self-motivated.

上海威峰电子科技有限公司是港商独资企业，集团下属有：成都威峰电子有限公司、苏州行政办事处、上海业务承接及销售办公室。
上海分公司位于松江出口加工区。公司下属公司通过了ISO—9001:2000质量管理体系认证、QS9000质量管理体系认证和16949质量管理体系认证以及ISO14000环境管理体系认证。
公司生产多种型号PCB及封装测试产品。同时涉及半导体行业专业人员培训、管理及市场信息统计。产品远销欧美、东南亚及中国港澳地区。