Molding Equipment Engineer
上海威峰电子科技有限公司
- 公司规模:500-1000人
- 公司性质:合资(非欧美)
- 公司行业:电子技术/半导体/集成电路
职位信息
- 发布日期:2019-07-02
- 工作地点:德州
- 招聘人数:1人
- 工作经验:无工作经验
- 学历要求:招1人
- 语言要求:不限
- 职位月薪:1-1.5万/月
- 职位类别:半导体技术
职位描述
Responsibilities:
1. Cooperate with assembly sustaining equipment engineer to ensure reliable transition from prototype to mass production.
2. Develops and execute effective PM plans for related prototype equipment. Ensure PM and calibration system meet ISO9000 requirements.
3. Responsible to document, update and maintain equipment control specification/WI/PM WI for prototype line per new product requirement.
4. Responsible to give clear instructions to prototype operations & technicians for all prototype machine operation.
5. Responsible for key machine upgrade tools ordering whenever needed for prototype line.
6. Drive suppliers on all the quality issues & capability improvement projects related to machines.
Requirements:
1. Bachelor degree or experience equivalent to that – Engineering related majors.
2. At least 5 years of work experience on Molding equipment engineering related field, Strong hands on & engineering management for assembly equipment.
3. English, fluent in listening / speaking / reading / writing, CET 6 is preferred.
职能类别: 半导体技术
公司介绍
上海分公司位于松江出口加工区。公司下属公司通过了ISO—9001:2000质量管理体系认证、QS9000质量管理体系认证和16949质量管理体系认证以及ISO14000环境管理体系认证。
公司生产多种型号PCB及封装测试产品。同时涉及半导体行业专业人员培训、管理及市场信息统计。产品远销欧美、东南亚及中国港澳地区。
联系方式
- 公司地址:地址:span松江出口加工区