DFM Engineer 半导体封装DFM工程师
苏州工业园区全通贸易有限公司
- 公司规模：500-1000人
- 公司性质：外资(欧美)
- 公司行业：电子技术/半导体/集成电路 快速消费品(食品、饮料、化妆品)
职位信息
- 发布日期：2012-11-14
- 工作地点：苏州
- 招聘人数：1
- 工作经验：五年以上
- 学历要求：本科
- 语言要求：英语精通
- 职位类别：半导体技术 技术研发工程师
职位描述
DESCRIPTION:
The DFM Engineers collaborates between the Product Lines, Technology Development and the GMSC organization to ensure manufacturability of new package products into manufacturing. The DFM Engineer will drive new package development Design For Manufacturability (DFM) methodologies. The candidate must have the ability to work with cross site teams, be an independent thinker, and possess diverse experience in assembly tooling, materials, and package design.
Responsibilities:
1) DFM (Design For Manufacturing) Program Management
? Drive New Package Introduction DFM methodology improvement & mfg simplification
? Identify and introduce Know Best Practices (KBP)
? Simplify the production flow to reduce cycle time
? Utilize DFM checklist
? Drive continuous improvement: document learning's & apply to new projects
? Reduce duplication of effort between product lines & functional groups
2) Collaboration & coordination between the Product Line, Technology & Manufacturing groups
? Serve as a technical resource to resolve issues
? Eliminate potential hand-off issues after Code S deployment
3) Align Manufacturing technology requirements and capacity with support from PL's, Technology, SCM and Finance
QUALIFICATIONS:
Engineer with 7 to 10 years of semiconductor manufacturing experience
Excellent verbal and written English communication skills
EDUCATION:
· BS/MS Engineering Degree or equivalent
The DFM Engineers collaborates between the Product Lines, Technology Development and the GMSC organization to ensure manufacturability of new package products into manufacturing. The DFM Engineer will drive new package development Design For Manufacturability (DFM) methodologies. The candidate must have the ability to work with cross site teams, be an independent thinker, and possess diverse experience in assembly tooling, materials, and package design.
Responsibilities:
1) DFM (Design For Manufacturing) Program Management
? Drive New Package Introduction DFM methodology improvement & mfg simplification
? Identify and introduce Know Best Practices (KBP)
? Simplify the production flow to reduce cycle time
? Utilize DFM checklist
? Drive continuous improvement: document learning's & apply to new projects
? Reduce duplication of effort between product lines & functional groups
2) Collaboration & coordination between the Product Line, Technology & Manufacturing groups
? Serve as a technical resource to resolve issues
? Eliminate potential hand-off issues after Code S deployment
3) Align Manufacturing technology requirements and capacity with support from PL's, Technology, SCM and Finance
QUALIFICATIONS:
Engineer with 7 to 10 years of semiconductor manufacturing experience
Excellent verbal and written English communication skills
EDUCATION:
· BS/MS Engineering Degree or equivalent
公司介绍
苏州工业园区全通贸易有限公司诚聘