苏州招聘

职位描述：
Board Solutions is a central team within NXP’s Technology & Operations organization responsible for design, manufacturing, compliance and supply chain operations of PCBs (boards). The organization provides PCB solutions to all business units within NXP through its global presence in US, EU, and Asia. Business units include consumer, industrial, automotive, digital networking, RF, analog, and sensors.

Shanghai Board Solutions team supports the New Production Introduction (NPI), system design, validation & testing, PCB assembly & manufacturing to worldwide NXP Business Units. The Board Solutions Design Engineer position is a role responsible for all aspects of hardware board design. The design goes from the initial concept to manufacturing, testability, safety and quality of the hardware products. The candidate will ensure their projects are consistent with company strategy, commitments and goals. The job location is NXP Pudong office, Shanghai.
 
Job responsibilities:

？ Utilize the NXP Controlled Library (NCL) to reuse design methodologies or leverage exiting designs and components to create board design as requirement
？ Collaborate with librarians or CAD team to implement NCL improvements
？ Provide design expertise and regional support for BU silicon, application teams, and third parties
？ Define architecture to implement design per Technical Requirements Document (TRD)
？ Drive standards for schematics, logic symbols, design for test, design for manufacturing, and certifications
？ Create preliminary parts list (PPL), schematics, layout requirements, and BOM; Submit, archive and release these items through Agile meeting quality and schedule requirements
？ Work with Marketing, Applications, CAD, Product Engineer, Test Engineer, and MPM to create a quality manufacturable product
？ Complete Design Verification Test (DVT) in conjunction with BU, software teams, and test engineering
？ Participate in peer reviews of schematics and layouts to improve products across the global Board Solutions team.
？ Participate global design engineer meeting to involve process improvement
？ Drive innovations in design process and design IP reuse, and provide training and promotion for new technologies and methodologies to BU design teams
？ Implement designs that are competitive with industry standards, high quality, cost effective, and delivered on time
？ Improve core competency in board design technologies
？ Escalate design related issues to Design Manager if necessary
Key Competencies:

？ Ability to understand system level design including mechanical, thermal, PCBA, cabling, PSU, firmware, etc.
？ Ability to understand manufacturing process and quality requirement. Understand DFx (DFM/DFA) process.
？ Ability to design high speed digital signal interface, e.g DDR, PCIe, USB, SATA and Ethernet.
？ Ability to design analog and power circuit, RF experience is a plus.
？ Ability to be familiar with all kinds of electronics components and their major manufacturing vendors.
？ Ability to understand regulatory requirement and experience with compliance test like FCC/CE.
？ Master Cadence tools including OrCAD and Allegro.
？ Good technical and analytical skill with ability to perform electronic system trouble shooting and debug effectively.
？ Ability of high speed signal simulation is a plus.
？ Knowledge in CPLD/FPGA design, micro-Controller programming, Linux programming will be an advantage.
？ Ability to occasional travel on an ‘as required’ basis.
Education and Experience:
？ Bachelor or Master degree in electronics, product & industrial design, or related filed, Master is a preferred.
？ 7-15 years experiences in hardware board design or equivalent working experience in a design/manufacturing environment.
？ Experience in Ethernet switch, router, wireless charging, embedded systems, power meter, NFC, RF and wireless, Touchpad/Touch-screen system development will be an extreme advantage.
？ Strong inter-personal and written & oral communication skills.
？ Have a determined mindset and personal commitment to high quality work with schedule.
？ Good teamwork adaptability and self-motivated ability.

一经录取，进入NXP半导体上海有限公司工作（浦东张江）

MICETEK源于国际著名的微处理器开发系统制造厂商MICROTEK。1981年5月，公司率先在全球推出全新概念的微处理器开发系统--MICE系列；且多年来一直致力于推动该产品领域的技术发展，取得了多项世界级的殊荣；并一直在全球保持着领先的市场占有率和稳定的增长幅度，同时亦是该领域的领导厂商。MICETEK拥有实力雄厚的研发队伍以及完备的营销网络， 可以在中国提供完善的销售与技术服务。在北京，上海，深圳设有办事处，研发中心和维修中心，国内每个主要城市均设有代理商，在中国的客户涵盖了工控，通讯，电子，医疗等各个领域，全球客户总数已超过50000个。
身为一个积极而创新的公司，二十多年来MICETEK除了仿真器的领域外，更提供嵌入式系统发展工具完整解决方案 ( Embedded System Total Solution )。其中包含了微电脑仿真器 ( In-Circuit Emulator )、系统评估板 ( Evaluation Board )、应用组件开发系统 ( ADS )、单板计算机 ( Single Board Computer )、集成开发环境 ( IDE )、编译器 ( Compiler ) 等嵌入式系统发展工具。
祥佑数码科技还代理销售了世界知名大厂的各类发展工具及芯片，如 EPI、Express Logic、Green Hills、Keil、InterNiche、ICE Technology、Freescale等。