苏州招聘

DESCRIPTION OF DUTIES (TO INDICATE ALL TASKS PERFORMED)
1. Perform electrical and physical device analysis of IC and material and recommend corrective actions whenever possible.
2. Lead and set direction for Device Analysis Engineers and EA
3. Conduct or facilitate training that improves skill set of Device Analysis Engineers and EAs
4. Develop device analysis tools/ techniques and seek breakthroughs
5. Drive tool/technique and skill-set roadmap
6. Participate in cross-functional activities or projects

REQUIRED KNOWLEDGE, SKILLS AND ABILITIES
1. Good knowledge on IC assembly / package and test.
2. Good knowledge on wafer fabrication process, package and device layout.
3. Device analysis techniques such as SEM / EDX / bench testing / cross-section, etc.
4. Understanding of device performance with design and / or packaging.
5. Sense of ownership and maintain equipment at optimal operating conditions.
6. Able to work with and understand acids / chemicals.
7. Able to publish the technical report / paper.
8. Able to work with all levels in a cross-functional environment.
9. Help build and maintain effective teams.
10. Independent, resourceful and takes initiative.

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