苏州招聘

DESCRIPTION:

The DFM Engineers collaborates between the Product Lines, Technology Development and the GMSC organization to ensure manufacturability of new package products into manufacturing. The DFM Engineer will drive new package development Design For Manufacturability (DFM) methodologies. The candidate must have the ability to work with cross site teams, be an independent thinker, and possess diverse experience in assembly tooling, materials, and package design.

Responsibilities:

1) DFM (Design For Manufacturing) Program Management
? Drive New Package Introduction DFM methodology improvement & mfg simplification
? Identify and introduce Know Best Practices (KBP)
? Simplify the production flow to reduce cycle time
? Utilize DFM checklist
? Drive continuous improvement: document learning's & apply to new projects
? Reduce duplication of effort between product lines & functional groups
2) Collaboration & coordination between the Product Line, Technology & Manufacturing groups
? Serve as a technical resource to resolve issues
? Eliminate potential hand-off issues after Code S deployment
3) Align Manufacturing technology requirements and capacity with support from PL's, Technology, SCM and Finance

QUALIFICATIONS:
? Engineer with 7 to 10 years of semiconductor manufacturing experience
? Excellent verbal and written English communication skills

EDUCATION:
? BS/MS Engineering Degree or equivalent

   安森美半导体苏州是全球首屈一指，针对多元终端市场提供高性能功率产品的全球第二大供应商。1999 年，安森美半导体从摩托罗拉分离出来，于 2000 年成为一家上市公司。
    苏州工厂是原Fairchild（快捷半导体）集团公司于2002年2月在中国设立的一家工厂。在2016年与安森美正式合并，公司坐落于苏州工业园区美丽的金鸡湖畔。2016年以来生产订单一直处于增长中，并不断扩产。公司现有员工1900多人，主要从事封测、产品开发和封装研发的业务。产品包含功率器件、模拟器件和功率模块，广泛运用于汽车、家电、消费电子等领域。

请同时提供中英文简历并注明应聘职位及期望薪资，您也可以登录 http://www.onsemi.com了解公司情况以及招聘职位的详细信息。此外国内招聘网站公司仅使用51Job和苏州圆才网。

乘车路线：100，28，142，207路到加城大厦站下车，往南走200米。
26，27，307，518，818路到苏桐路站下车，往南走50米。