苏州招聘

职位描述：
Backend

The back-end segments Sensors, Chip Card and Chip Embedding allow the development of cross-collaborative innovations over the entire value chain from chip production to wafer testing, preassembly, package design and the development of new materials.
In your new role you will:
? Capacity planning (VRFC), scenario planning and data analysis.
? IE baseline setup; drive standardization through IE study and validation.
? Space planning and layout optimization (space algo & reference cell).
? Lead or support factory/productivity improvement project.
? TCR planning and target setting including (OEE elements &cycle Time analysis).
? Material efficiency analysis and improvement.
You are best equipped for this task if you have:
? Bachelor Degree holder preferably in Industrial Engineering / Manufacturing System Engineering / Engineering Management / Mechanical Engineering
? More than 6 years related working experience.Relevant experience in semiconductor industry / Assembly-Test operation will be a plus
? Familiar with MS Office software especially Excel and Powerpoint.
? Knowledge in using AutoaCAD, SAP, JMP, Access and other programming.
? Ability to communicate and write in English.
? Good problem solving skill and ability to provide idea / alternative. 举报 分享

我们公司主要负责世界500强欧美企业，且主要负责制造业：机械、电气、电子等行业；