苏州招聘

职位描述：
1.3-5 years experience in package assembly manufacturing or development
2.Be familiar with assy process flow and packaging develop concept.
3.Familiar with new product introduction(NPI) handling procedure.
4.Can read engineer drawings (substrate lead frame drawing, Bonding drawing, etc.)
5.Experience on project management is preferred, Lead new product introduction as leader
6.Good coordinate skill, Communication skill. Team Work.
7.Good verbal and written communication skills (English and Chinese).
Responsibilities:
a.Contact with customer for the new product schedule or process set-up& QT.
b.Coordinate process set-up & QT internal schedule to meet customer''s requirement.
c.Establish specifications, procedures and BOM systems for customer’s product
d.Generate or review/approve assembly build instructions, create SWR for process set-up,QT & EWS.
e.Arrange engineer line for SWR.
f.Coordinate abnormal issue of process set-up & QT.
g.Facilitate new product release meeting.
h.Contact with customer for new product spec.
i.Chair NPI internal daily meeting.
j.Document all needed /qual paperwork per internal/external audit requirement.
k.Communicate comfortably with customers, suppliers and internal departments to coordinate deliverables and meet deadlines. 举报 分享

力成科技股份有限公司是一家居行业领导地位的半导体封装测试公司，为客户提供完善的半导体后段供应链建置及全方位封装测试服务，总部位于中国台湾省。服务范围涵盖晶圆针测、封装、测试至成品的全球出货。目前力成科技已拥有包括苏州厂在内的超过4500名的员工，一贯坚持策略性结盟模式及永不止于现状的改善态度，凭借着先进技术、世界级厂房及满足客户最经济且高效能需求条件下，提供客户最可靠的品质。过去十年的努力，超过50％的复合成长率让力成科技成为全球第五名的IC后端厂商，同时也在记忆体产品的应用上稳居第一名的位置，为世界一流的IDM及IC设计客户群提供每月超过210M的出货量，显示了力成科技卓越的制造产能与能力。

目前力成（苏州）拥有约近500名员工，将突破之前专注于生产制造的运营模式，除了保持已有的半导体封装测试外，还建立了销售和客服务队，同时还建立了自己的研发中心，以及本土化的供应链，产品范围除了现有的闪存外，还将扩展到其他形式的记忆体，逻辑元器件等。

这需要大量人才，需要我们的团队合作，我们将吸收更多的优秀人才来壮大我们的队伍。未来，我们将更加专注于质量和服务，在技术和成本上也力求卓越，最终将力成（苏州）打造成国内一流的半导体后端服务供应商。