R&D 工程师
赫比(苏州)通讯科技有限公司
- 公司规模:500-1000人
- 公司性质:外资(非欧美)
- 公司行业:电子技术/半导体/集成电路
职位信息
- 发布日期:2017-01-19
- 工作地点:苏州
- 招聘人数:若干人
- 学历要求:专业培训
- 职位月薪:0.8-1万/月
- 职位类别:技术研发工程师
职位描述
职位描述:
1. FPC/SMT所用材料/流程的研究。
1. R&D all the material/ Process used in FPC/SMT.
2. 新材料/新流程的开发与引进。
2 R&D and import the new material.
3. 产品应用的研究。
3 R&D in FPC/SMT application.
1.新材料测试方法与计划的制定.
1. Design the test method and plan for the new material
2.FPC/SMT 材料选择标准/标准工艺流程的制定。
2.Standardize the material selection rules and process for FPC/SMT.
3.FPC/SMT应用中有关材料及流程,产品客户应用中问题解决。
3.Involve the problem saving in the FPC/SMT application about material and process.
4.参与材料供应商的初步评估。
4. Involve the material suppler evaluate.
5.参与生产良率的提升。
5. Involve the yield improvement.
熟悉各类FPC/SMT的制作方法,以及所用工具。
Know the process of all kinds of board, and the tooling will be used.
熟练FPC/SMT所用到的各种材料与性能。
Know the material will be use in the FPC/SMT.
对于FPC/SMT的制作成本有一定了解
Know FPC/SMT manufacturing cost.
举报
分享
1. FPC/SMT所用材料/流程的研究。
1. R&D all the material/ Process used in FPC/SMT.
2. 新材料/新流程的开发与引进。
2 R&D and import the new material.
3. 产品应用的研究。
3 R&D in FPC/SMT application.
1.新材料测试方法与计划的制定.
1. Design the test method and plan for the new material
2.FPC/SMT 材料选择标准/标准工艺流程的制定。
2.Standardize the material selection rules and process for FPC/SMT.
3.FPC/SMT应用中有关材料及流程,产品客户应用中问题解决。
3.Involve the problem saving in the FPC/SMT application about material and process.
4.参与材料供应商的初步评估。
4. Involve the material suppler evaluate.
5.参与生产良率的提升。
5. Involve the yield improvement.
熟悉各类FPC/SMT的制作方法,以及所用工具。
Know the process of all kinds of board, and the tooling will be used.
熟练FPC/SMT所用到的各种材料与性能。
Know the material will be use in the FPC/SMT.
对于FPC/SMT的制作成本有一定了解
Know FPC/SMT manufacturing cost.
职能类别: 技术研发工程师
公司介绍
赫比国际有限公司成立于1980年,是涉足机电模具、通讯业、消费电子和计算机业的领先供应商。我们多元化的服务涉及工业和产品设计,制造,组装以及配套增值服务如表面处理的精加工、外包制造以及精密金属冲压。
赫比公司的总部位于新加坡,全球共拥有15处工厂和技术支持中心。现有约20,000名雇员服务于赫比公司。
如果您希望了解更多的信息,欢迎登陆我们公司主页www.hi-p.com
Founded in 1980,Hi-P is a leading supplier of electro-mechanical modules to the telecommunications, consumer electronics and computing industries. Our diversified service offering ranges from industrial and product design, manufacture, assembly, ancillary value –added services such as surface decoration finishing and precision metal stamping as well as turnkey contract manufacturing.
Headquartered in Singapore, Hi-p has an extensive footprint with 15 manufacturing plants globally and engineering-support centers. We currently employ about 20,000 people.
For more information, please review our website: www.hi-p.com
赫比公司的总部位于新加坡,全球共拥有15处工厂和技术支持中心。现有约20,000名雇员服务于赫比公司。
如果您希望了解更多的信息,欢迎登陆我们公司主页www.hi-p.com
Founded in 1980,Hi-P is a leading supplier of electro-mechanical modules to the telecommunications, consumer electronics and computing industries. Our diversified service offering ranges from industrial and product design, manufacture, assembly, ancillary value –added services such as surface decoration finishing and precision metal stamping as well as turnkey contract manufacturing.
Headquartered in Singapore, Hi-p has an extensive footprint with 15 manufacturing plants globally and engineering-support centers. We currently employ about 20,000 people.
For more information, please review our website: www.hi-p.com
联系方式
- 公司地址:上班地址:苏州市吴中区郭巷街道河东工业园区六丰路86号