商丘招聘

岗位要求

1.大专以上学历，机械设计或模具设计专业。

2.精通手机模具设计及注塑成型工艺，对塑胶件不良现象提出改善方案。

3.精通模具的制造流程与工艺，熟悉手机结构件表面处理工艺。

4.了解或精通纳米注塑，压铸，CNC工艺。

5.熟练并独立运用CAD、PRO-E、UG，mold flow，office等软件。

6.诚实开朗，态度积极，沟通能力与跨部门协调能力良好。

岗位职责

1.参与新项目结构设计评审，参与供应商模具设计评审，提出模具开发的设计方案。

2.审核模具设计图纸，对模具设计提出改善建议。

3.审核结构设计组装工艺与组装治具可行性，审核结构件表面处理工艺的可行性，做出风险评估，指导供应商做出改善。

4.审核结构件FAI，CPK，提出模具设变与注塑的改善建议，签核结构件承认书。

5.主导复制模互配，保证复制模按期试模与量产。

6.解决塑模/成型方面的难题，对模具与注塑品质异常作出原因分析，指导供应商改善以保证生产稳定性。

7.协助项目经理和上级主管达成设计目标和交付目标。

公司主营通讯和半导体两大业务板块，目前已经形成从芯片设计、晶圆制造、半导体封装测试到产业物联网、通讯终端、笔记本电脑、IoT、汽车电子产品研发制造于一体的庞大产业布局。
通讯业务板块
包括手机、平板、笔电、IoT、汽车电子等领域，服务的客户均为全球主流品牌，已经与90%以上的主流品牌建立合作关系并不断深化。研发中心分布在上海、无锡、深圳、西安，制造基地分布在嘉兴、无锡、印度和印尼，另外在美国、韩国、日本设立了创新中心。
国际数据公司IDC、美国市场调研机构IHS和中国赛诺市场研究公司的研究数据均显示，闻泰连续多年出货量在全球手机ODM（原始设计制造）行业中处于龙头地位。
半导体业务板块
闻泰科技旗下的安世半导体是全球知名的半导体IDM公司，是原飞利浦半导体标准产品事业部，有60多年半导体研发和制造经验，总部位于荷兰奈梅亨，晶圆制造工厂在德国汉堡和英国曼彻斯特，封装测试工厂位于中国东莞、菲律宾卡布尧和马拉西亚芙蓉。客户超过2.5万个，产品种类超过1.5万种，每年新增700多种新产品，全部为车规级产品。安世半导体年产能超过1000亿颗，在与欧美半导体巨头的竞争中，安世在各个细分领域均处于全球领先。

Wingtech Technology
-- The world's leading company in communications and semiconductor.

Wingtech’s main business includes communication terminal and semiconductor business. We have formed a huge industry layout from chip design, wafer manufacturing, semiconductor packaging test to IIoT, communication terminals, laptop, IoT, auto electronic products R&D manufacturing.

Communications Business:
The communication terminal business include mobile phones, tablets, laptops, IoT and other fields. The customers we served are all global top brands, and we have established cooperative relationship with more than 90% of the mainstream brands and kept deepening it. R&D centers are located in Shanghai, Wuxi, Shenzhen, and Xi 'an, manufacturing bases are located in Jiaxing, Wuxi, India and Indonesia, and innovation centers are located in the United States, South Korea and Japan.
Research data from international data company IDC, American market research institute IHS and China's Sano market research which all showed that Wingtech Technology's shipments have been in the leading position in the global mobile phone ODM (original design and manufacturing) industry for continuous years.

Semiconductor Business:
Nexperia is the world-renowned semiconductor IDM company, which belongs to Wingtech Technology. Nexperia was the original Royal Philips semiconductor standard products division. They have more than 60 years of semiconductor R&D and manufacturing experience, headquartered in Nijmegen, Netherlands, wafer manufacturing located in Hamburg, Germany and the UK Manchester, assembly factory in Dongguan, China, Cabuyao, Philippines and Seremban, Malaysia. They have more than 25,000 customers and more than 15,000 types of products. More than 700 new products are added for every year, all of them are vehicle regulation level products.
Nexperia annual production capacity is more than 100 billion units. During the competition with various European and American semiconductor giant, Nexperia is the world leader in each segment.