资金计划主管
闻泰通讯股份有限公司
- 公司规模:1000-5000人
- 公司行业:通信/电信/网络设备
职位信息
- 发布日期:2019-10-01
- 工作地点:深圳
- 招聘人数:若干人
- 工作经验:5-7年经验
- 学历要求:本科
- 职位月薪:1-1.2万/月
- 职位类别:资金经理/主管
职位描述
1、负责制定并完善集团资金预算及支付计划的政策和管理流程
2、负责日常运营资金管理,资金滚动预算、主要法人财报指标分析等
3、负责分析中长期资本架构分析,协助制定中长期规划
4、分析融资产品,优化资金结构,降低融资成本,提供相应的融资类数据分析
岗位吸引力:业务增长迅猛的上市公司,管理团队有成熟的管理体系和思路,学习和成长空间很大。
职位要求:
1、本科及以上学历,财经类专业背景,211,985院校优先
2、5年以上资金管理工作经验,有大型企业工作经验优先
3、金融知识扎实,熟练掌握资金、外汇等业务知识,具有良好的分析判断能力
4、工作细致、责任感强,具有良好的沟通协调能力和语言文字表达能力
职能类别:资金经理/主管
公司介绍
公司主营通讯和半导体两大业务板块,目前已经形成从芯片设计、晶圆制造、半导体封装测试到产业物联网、通讯终端、笔记本电脑、IoT、汽车电子产品研发制造于一体的庞大产业布局。
通讯业务板块
包括手机、平板、笔电、IoT、汽车电子等领域,服务的客户均为全球主流品牌,已经与90%以上的主流品牌建立合作关系并不断深化。研发中心分布在上海、无锡、深圳、西安,制造基地分布在嘉兴、无锡、印度和印尼,另外在美国、韩国、日本设立了创新中心。
国际数据公司IDC、美国市场调研机构IHS和中国赛诺市场研究公司的研究数据均显示,闻泰连续多年出货量在全球手机ODM(原始设计制造)行业中处于龙头地位。
半导体业务板块
闻泰科技旗下的安世半导体是全球知名的半导体IDM公司,是原飞利浦半导体标准产品事业部,有60多年半导体研发和制造经验,总部位于荷兰奈梅亨,晶圆制造工厂在德国汉堡和英国曼彻斯特,封装测试工厂位于中国东莞、菲律宾卡布尧和马拉西亚芙蓉。客户超过2.5万个,产品种类超过1.5万种,每年新增700多种新产品,全部为车规级产品。安世半导体年产能超过1000亿颗,在与欧美半导体巨头的竞争中,安世在各个细分领域均处于全球领先。
Wingtech Technology
-- The world's leading company in communications and semiconductor.
Wingtech’s main business includes communication terminal and semiconductor business. We have formed a huge industry layout from chip design, wafer manufacturing, semiconductor packaging test to IIoT, communication terminals, laptop, IoT, auto electronic products R&D manufacturing.
Communications Business:
The communication terminal business include mobile phones, tablets, laptops, IoT and other fields. The customers we served are all global top brands, and we have established cooperative relationship with more than 90% of the mainstream brands and kept deepening it. R&D centers are located in Shanghai, Wuxi, Shenzhen, and Xi 'an, manufacturing bases are located in Jiaxing, Wuxi, India and Indonesia, and innovation centers are located in the United States, South Korea and Japan.
Research data from international data company IDC, American market research institute IHS and China's Sano market research which all showed that Wingtech Technology's shipments have been in the leading position in the global mobile phone ODM (original design and manufacturing) industry for continuous years.
Semiconductor Business:
Nexperia is the world-renowned semiconductor IDM company, which belongs to Wingtech Technology. Nexperia was the original Royal Philips semiconductor standard products division. They have more than 60 years of semiconductor R&D and manufacturing experience, headquartered in Nijmegen, Netherlands, wafer manufacturing located in Hamburg, Germany and the UK Manchester, assembly factory in Dongguan, China, Cabuyao, Philippines and Seremban, Malaysia. They have more than 25,000 customers and more than 15,000 types of products. More than 700 new products are added for every year, all of them are vehicle regulation level products.
Nexperia annual production capacity is more than 100 billion units. During the competition with various European and American semiconductor giant, Nexperia is the world leader in each segment.
通讯业务板块
包括手机、平板、笔电、IoT、汽车电子等领域,服务的客户均为全球主流品牌,已经与90%以上的主流品牌建立合作关系并不断深化。研发中心分布在上海、无锡、深圳、西安,制造基地分布在嘉兴、无锡、印度和印尼,另外在美国、韩国、日本设立了创新中心。
国际数据公司IDC、美国市场调研机构IHS和中国赛诺市场研究公司的研究数据均显示,闻泰连续多年出货量在全球手机ODM(原始设计制造)行业中处于龙头地位。
半导体业务板块
闻泰科技旗下的安世半导体是全球知名的半导体IDM公司,是原飞利浦半导体标准产品事业部,有60多年半导体研发和制造经验,总部位于荷兰奈梅亨,晶圆制造工厂在德国汉堡和英国曼彻斯特,封装测试工厂位于中国东莞、菲律宾卡布尧和马拉西亚芙蓉。客户超过2.5万个,产品种类超过1.5万种,每年新增700多种新产品,全部为车规级产品。安世半导体年产能超过1000亿颗,在与欧美半导体巨头的竞争中,安世在各个细分领域均处于全球领先。
Wingtech Technology
-- The world's leading company in communications and semiconductor.
Wingtech’s main business includes communication terminal and semiconductor business. We have formed a huge industry layout from chip design, wafer manufacturing, semiconductor packaging test to IIoT, communication terminals, laptop, IoT, auto electronic products R&D manufacturing.
Communications Business:
The communication terminal business include mobile phones, tablets, laptops, IoT and other fields. The customers we served are all global top brands, and we have established cooperative relationship with more than 90% of the mainstream brands and kept deepening it. R&D centers are located in Shanghai, Wuxi, Shenzhen, and Xi 'an, manufacturing bases are located in Jiaxing, Wuxi, India and Indonesia, and innovation centers are located in the United States, South Korea and Japan.
Research data from international data company IDC, American market research institute IHS and China's Sano market research which all showed that Wingtech Technology's shipments have been in the leading position in the global mobile phone ODM (original design and manufacturing) industry for continuous years.
Semiconductor Business:
Nexperia is the world-renowned semiconductor IDM company, which belongs to Wingtech Technology. Nexperia was the original Royal Philips semiconductor standard products division. They have more than 60 years of semiconductor R&D and manufacturing experience, headquartered in Nijmegen, Netherlands, wafer manufacturing located in Hamburg, Germany and the UK Manchester, assembly factory in Dongguan, China, Cabuyao, Philippines and Seremban, Malaysia. They have more than 25,000 customers and more than 15,000 types of products. More than 700 new products are added for every year, all of them are vehicle regulation level products.
Nexperia annual production capacity is more than 100 billion units. During the competition with various European and American semiconductor giant, Nexperia is the world leader in each segment.
联系方式
- 公司地址:深圳市罗湖区黄贝岭地铁站