Sr. HW Engineer(BSP Engineer)
菲尼萨光电通讯(上海)有限公司
- 公司规模:500-1000人
- 公司性质:外资(欧美)
- 公司行业:通信/电信/网络设备
职位信息
- 发布日期:2012-08-17
- 工作地点:上海
- 招聘人数:1
- 工作经验:三年以上
- 学历要求:硕士
- 语言要求:英语熟练
- 职位类别:高级硬件工程师 电子技术研发工程师
职位描述
Requirements:
1. 3+ years of work experience implementing device drivers and boot code on embedded Linux platforms
2. Have hands-on experience bringing up and troubleshooting embedded Linux platforms
3. Outstanding hardware/software debugging skills using a full range of test equipment
4. Strong knowledge of Linux driver programming, kernel architecture and u-boot architecture
5. Solid understanding of Ethernet PHYs, PCIe, USB, SPI, I2C and SDRAM
6. Knowledge of embedded OS architecture
7. Excellent verbal and written communication skills in English
8. Fluent in the assembly and C language and embedded debugging
9. MS in EE or CS
Responsibilities:
1. Customize BSP, device drivers and boot code for each new embedded Linux platform
2. Work closely with hardware engineers to bring up new boards
3. Identify and fix performance issues that are caused by device drivers, boot code and FPGA code
4. Work with SW developer to verify all driver modules can be correct used for SW platform.
5. Cooperate with other site to conduct global HW/SW development.
1. 3+ years of work experience implementing device drivers and boot code on embedded Linux platforms
2. Have hands-on experience bringing up and troubleshooting embedded Linux platforms
3. Outstanding hardware/software debugging skills using a full range of test equipment
4. Strong knowledge of Linux driver programming, kernel architecture and u-boot architecture
5. Solid understanding of Ethernet PHYs, PCIe, USB, SPI, I2C and SDRAM
6. Knowledge of embedded OS architecture
7. Excellent verbal and written communication skills in English
8. Fluent in the assembly and C language and embedded debugging
9. MS in EE or CS
Responsibilities:
1. Customize BSP, device drivers and boot code for each new embedded Linux platform
2. Work closely with hardware engineers to bring up new boards
3. Identify and fix performance issues that are caused by device drivers, boot code and FPGA code
4. Work with SW developer to verify all driver modules can be correct used for SW platform.
5. Cooperate with other site to conduct global HW/SW development.
公司介绍
II-VI公司是全球领先的工程材料和光电子器件制造商。作为一家垂直一体化的公司,其为通信、材料加工、半导体材料设备、生命科学、消费电子和汽车等市场开发多样化应用的创新产品。公司总部位于美国宾夕法尼亚州萨克森堡,在全球拥有研发、制造、销售、服务和分销等中心。该公司生产各种特定用途的光子和电子材料及组件,并以各种形式有效利用它们,包括集成先进的软件来支持我们的客户。II-VI高意研发中心遍布全球多个城市,其中芯片的研发和生产主要位于美国、英国、瑞士等。半导体激光器在瑞士和英国都有研发中心;光收发模块的研发中心主要在美国Fremont和中国上海;其他光器件产品以及光学平台的研发则主要在中国上海和福州。
联系方式
- Email:recruitment@finisar.com
- 公司地址:地址:span陈行公路2168号临港浦江国际科技城内浦江智慧广场11A