上海招聘

职位描述：
Job Responsibilities:
1. Perform process optimization/DOE to robust WB process.
2. Troubleshoot and resolve process yield/productivity issues for HVM devices.
3. Perform New Material Qualification & Process Development to meet new technology roadmap.
4. Develop Best Known Methodology (BKM) & identify opportunity for quality & cost improvement.
5. Perform buy-off and qualification of new/transferred Wire Bonders based on defined standards and specifications.

Job Qualification:
1. Recipe Generation (including OLP) / Capillary Selection / Parameter Setting / Looping Optimization.
2. Wire Bonder Machine Operation & Process Trouble shooting
3. Knowledgeable on different wire bond packaging technology such as multi chip and stack die bonding, Ultra Fine pitch bonding and Low-k wafer bonding.
4. Knowledgeable in Engineering Statistical tools such as SAS JMP, Anova, Hyphotesis Testing, Commonality analysis, SPC and Pareto charts etc.
5. Knowledgeable with hands-on experience on different Wire bond platform by industry leading suppliers such as KnS and Shinkawa. 举报 分享

       星科金朋公司是世界排名前列的半导体封装测试公司，提供全球各地客户整体与快捷的高质量服务。客户群包括数家晶圆代工厂、全球知名IDM大厂与遍布全球各地集成电路设计公司。服务产品种类含盖通信、电脑、电源供应器与数据型消费性产品等。以先进制造与管理技术为基础，加上全球性布局，星科金朋在全球封装测试业树立了可靠与高质量服务的标竿。星科金朋公司在全球拥有一万多名员工，在新加坡、中国及中国台湾地区、韩国、马来西亚和美国等地设有工厂。
星科金朋（上海）有限公司位于上海西郊经济技术开发区，距虹桥机场仅8公里之遥，现有员工三千多人，占地面积11万平方米。公司提供定期和不定期的员工海外培训机会，为员工的发展提供广阔的平台。

公司将根据资历和相关工作经验对应聘成功者提供具有竞争力的薪金和福利，及相应的国内外培训机会。
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