Wafer Backend/Assembly Engineer
上海美维科技有限公司
- 公司规模:1000-5000人
- 公司性质:外资(欧美)
- 公司行业:电子技术/半导体/集成电路
职位信息
- 发布日期:2015-06-13
- 工作地点:上海-松江区
- 招聘人数:1
- 工作经验:3-4年
- 学历要求:本科
- 语言要求:英语精通
- 职位月薪:面议
- 职位类别:集成电路IC设计/应用工程师 电子技术研发工程师
职位描述
Job Objectives:
To handle die attach related issues in technology transfer from a USA technology partner and set up process. Responsibilities include review die attach related documents; production line evaluation; process setup and standardization; co-work with other process engineers and PD to solve sample run problem; other tasks related to product characterization that assigned by the superior.
Areas of Responsibilities:
Die attach related documents review and upgrade.
Production line evaluation.
Process setup and standardization.
Co-work with other engineer and PD for sample run
Other assigned job by the superior.
Qualification:
Bachelor of Science/Technology or above, major EE is preferred.
Experience:
3+ Years die attach process in IC packaging experience
Key Competencies & Skills:
Good knowledge of die attach process;
Strong process evaluation/control skill
Quick learning capability;
English as working language
本职位为集团总部委托发布,有意者请将简历发至:haixing.zhou@smst.ttmtech.com.cn,合则约见!
To handle die attach related issues in technology transfer from a USA technology partner and set up process. Responsibilities include review die attach related documents; production line evaluation; process setup and standardization; co-work with other process engineers and PD to solve sample run problem; other tasks related to product characterization that assigned by the superior.
Areas of Responsibilities:
Die attach related documents review and upgrade.
Production line evaluation.
Process setup and standardization.
Co-work with other engineer and PD for sample run
Other assigned job by the superior.
Qualification:
Bachelor of Science/Technology or above, major EE is preferred.
Experience:
3+ Years die attach process in IC packaging experience
Key Competencies & Skills:
Good knowledge of die attach process;
Strong process evaluation/control skill
Quick learning capability;
English as working language
本职位为集团总部委托发布,有意者请将简历发至:haixing.zhou@smst.ttmtech.com.cn,合则约见!
公司介绍
安捷利美维电子(厦门)有限公司成立于2019年,由安捷利实业(港交所:1639)及厦门半导体投资集团等共同出资45亿人民币设立,总部位于厦门市,生产基地分别位于广州黄埔和上海松江。公司致力于高密度电子互连解决方案集成商的发展战略,形成了高密度互连技术国际领先的产业地位,包含半导体集成电路封装基板(Substrate)、类载板(SLP)、任意层高密度互连板(Anylayer HDI)、高密度软硬结合板(RF HDI)四类国际领先的产品线,为世界一流客户提供产品和服务,产品广泛用于手机、计算机、通讯、医疗、汽车、物联网、5G基站、网络等领域。
上海美维科技有限公司创建于1999年,注册资金3.6亿元,总投资超过10亿元。美维科技是上海市“专精特新”企业、上海市集成电路行业协会理事单位、松江区企业技术中心等,并获得多家知名企业颁布的优秀供应商奖。公司是高新技术企业,产品是封装类基板,5G、通讯相关产业;国家扶持力度大,在现有产能基础上扩产2-3倍并新增苏州和厦门项目。
公司提供宿舍、工作餐、员工班车及年终奖、绩效奖及年休假、有薪事假等薪酬福利。
公司地址:上海市松江区工业区联阳路685号
招聘邮箱:yuanhua.qin@akmmv.com
上海美维科技有限公司创建于1999年,注册资金3.6亿元,总投资超过10亿元。美维科技是上海市“专精特新”企业、上海市集成电路行业协会理事单位、松江区企业技术中心等,并获得多家知名企业颁布的优秀供应商奖。公司是高新技术企业,产品是封装类基板,5G、通讯相关产业;国家扶持力度大,在现有产能基础上扩产2-3倍并新增苏州和厦门项目。
公司提供宿舍、工作餐、员工班车及年终奖、绩效奖及年休假、有薪事假等薪酬福利。
公司地址:上海市松江区工业区联阳路685号
招聘邮箱:yuanhua.qin@akmmv.com
联系方式
- Email:yuanhua.qin@akmmv.com
- 公司地址:上海市松江区工业区联阳路685号