EE Manager
赫比国际有限公司
- 公司规模:10000人以上
- 公司性质:外资(非欧美)
- 公司行业:多元化业务集团公司
职位信息
- 发布日期:2015-06-13
- 工作地点:上海-浦东新区
- 招聘人数:1
- 工作经验:8-9年
- 学历要求:本科
- 语言要求:英语精通
- 职位月薪:面议
- 职位类别:家用电器/数码产品研发
职位描述
Job Description:
1. Lead team to drive ODM project design from product requirement definition towards feasibility study, Design concept, Schematic development, Component selection, PCB layout, Prototype building, Debugging and Documentation.
2. Lead team to provide technical support for OEM project on Design optimization and improvement, Cost reduction, assembly DFM, PCBA test and debugging…
3. Drive EE team to achieve hardware design job according to project development schedule.
4. Be responsible for the team's resource planning and project management
5. Work effectively to support internal and external function i.e. BD, Sourcing, PM, Manufacturing and customer inquiry
6. Develop and follow the process, procedure and instruction related to engineering & management
7. Manage and monitor the main projects and products development and related process
REQUIREMENT:
1.Bachelor degree or above with electronic engineering related major, at least 7 years working experience in related field;
2. Be experienced in a manager/leader role in multinational company
3. Be able to communicate effectively with customer, supplier and all level in company
4. Excellent organizational, communication and cooperation ability
5. Hardware design and develop capability in small home appliance or consumer electronics
6. OEM project support or management experience, good knowledge in new project pilot run and approval process
7. Good knowledge in PCBA assembly and system assembly manufacturing
8. Good language skill (English & Chinese); written and oral
9. Be familiar with Altium, Allegro or Mentor; Microsoft Office (Words, Excel, PowerPoint);
10. Strong leadership skill and drive for result through others and self
11. Strong capability in resolve issue and capable in standardization in process and procedure
12. With below backgrounds will be great: Power supply design; 8/16/32 bit MCU application; Motor application
1. Lead team to drive ODM project design from product requirement definition towards feasibility study, Design concept, Schematic development, Component selection, PCB layout, Prototype building, Debugging and Documentation.
2. Lead team to provide technical support for OEM project on Design optimization and improvement, Cost reduction, assembly DFM, PCBA test and debugging…
3. Drive EE team to achieve hardware design job according to project development schedule.
4. Be responsible for the team's resource planning and project management
5. Work effectively to support internal and external function i.e. BD, Sourcing, PM, Manufacturing and customer inquiry
6. Develop and follow the process, procedure and instruction related to engineering & management
7. Manage and monitor the main projects and products development and related process
REQUIREMENT:
1.Bachelor degree or above with electronic engineering related major, at least 7 years working experience in related field;
2. Be experienced in a manager/leader role in multinational company
3. Be able to communicate effectively with customer, supplier and all level in company
4. Excellent organizational, communication and cooperation ability
5. Hardware design and develop capability in small home appliance or consumer electronics
6. OEM project support or management experience, good knowledge in new project pilot run and approval process
7. Good knowledge in PCBA assembly and system assembly manufacturing
8. Good language skill (English & Chinese); written and oral
9. Be familiar with Altium, Allegro or Mentor; Microsoft Office (Words, Excel, PowerPoint);
10. Strong leadership skill and drive for result through others and self
11. Strong capability in resolve issue and capable in standardization in process and procedure
12. With below backgrounds will be great: Power supply design; 8/16/32 bit MCU application; Motor application
公司介绍
赫比国际有限公司成立于1980年,是涉足机电模具、通讯业、消费电子和计算机业的领先供应商。我们多元化的服务涉及工业和产品设计,制造,组装以及配套增值服务如表面处理的精加工、外包制造以及精密金属冲压。
赫比公司的总部位于新加坡,全球共拥有15处工厂和技术支持中心。现有约20,000名雇员服务于赫比公司。
如果您希望了解更多的信息,欢迎登陆我们公司主页************
Founded in 1980,Hi-P is a leading supplier of electro-mechanical modules to the telecommunications, consumer electronics and computing industries. Our diversified service offering ranges from industrial and product design, manufacture, assembly, ancillary value –added services such as surface decoration finishing and precision metal stamping as well as turnkey contract manufacturing.
Headquartered in Singapore, Hi-p has an extensive footprint with 15 manufacturing plants globally and engineering-support centers. We currently employ about 20,000 people.
For more information, please review our website: ************
赫比公司的总部位于新加坡,全球共拥有15处工厂和技术支持中心。现有约20,000名雇员服务于赫比公司。
如果您希望了解更多的信息,欢迎登陆我们公司主页************
Founded in 1980,Hi-P is a leading supplier of electro-mechanical modules to the telecommunications, consumer electronics and computing industries. Our diversified service offering ranges from industrial and product design, manufacture, assembly, ancillary value –added services such as surface decoration finishing and precision metal stamping as well as turnkey contract manufacturing.
Headquartered in Singapore, Hi-p has an extensive footprint with 15 manufacturing plants globally and engineering-support centers. We currently employ about 20,000 people.
For more information, please review our website: ************
联系方式
- 公司地址:浦东新区前滩国际广场 (邮编:201206)