上海招聘

KEY JOB DUTIES & RESPONSIBILITIES:

1. Be responsible for advanced fiber-optical package front end process technology development and study including Cu Pillar Flip Chip Process, thermocompression bond process and laser eutectic etc
2. Be responsible for advanced manufacture assembly platform development such as high efficiency DFB COC platform including 4T COC eutectic die bonding and COC auto stitch bond bond platform etc;
3. Be responsible for LW parallel ceramic TO OSA front end process development including QSFP 4XLR OSA, 32G FC OSA, 25/28G OSA, QSFP LR4 Gen2 and 25/28G BH laser COC etc.
4. Be responsible for OSA c
5. Be responsible for SBR support from SHG R&D pilot line for overall R&D sides and project;

SKILLS/QUALIFICATIONS (include Education, Skills & Experience):
1. Bachelor degree or above in Material Engineer, Mechanical Engineering or related engineering discipline;
2. Minimum 5 years relevant experience in semiconductor or laser/fiber optics package process development/NPI/manufacture.
3. Be familiar with semiconductor or fiber-optical package process and deep understanding assembly process technology and assembly tool/platform for key process such as eutectic bond, epoxy bond, flip chip, SMT and reflow etc;
4. Have assembly process development project or NPI project management experience;
5. Be master of DFM,SPC, DFMEA/PFMEA, Process Failure Analysis and DOE;
6. Good communication capability in spoken and written Chinese and English.
7. Good problem solving, interpersonal and analytical skills.
8. Willing to oversea travel for globe projects/sites support

II-VI公司是全球领先的工程材料和光电子器件制造商。作为一家垂直一体化的公司，其为通信、材料加工、半导体材料设备、生命科学、消费电子和汽车等市场开发多样化应用的创新产品。公司总部位于美国宾夕法尼亚州萨克森堡，在全球拥有研发、制造、销售、服务和分销等中心。该公司生产各种特定用途的光子和电子材料及组件，并以各种形式有效利用它们，包括集成先进的软件来支持我们的客户。II-VI高意研发中心遍布全球多个城市，其中芯片的研发和生产主要位于美国、英国、瑞士等。半导体激光器在瑞士和英国都有研发中心；光收发模块的研发中心主要在美国Fremont和中国上海；其他光器件产品以及光学平台的研发则主要在中国上海和福州。