上海招聘

Candidate Responsibilities:
-Develop and qualify new material for Semiconductor package and process
-Define material specification and maintain BOM life cycle.
-Develop material policy and material roadmap -Identify cost down opportunity and drive projects to enhance package competitiveness
-Apply Statistical analysis tools, failure analysis and problem solving techniques to enhance material performance
-Located in Hong Kong

Candidate Profile:
-Minimum 10 years working experience in semiconductor packaging and material development
-PhD or Master degree in engineering disciplines or materials science
--Experience in package development and material characterization methods, e.g. leadframe, die attach, wire, mold compound, etc.
-Project management with suppliers and multiple production sites.
-Sound knowledge in statistical analysis, quality and problem solving tools, e.g. DOE, SPC, FMEA, Ford 8D, etc.
-Qualification in 6 sigma black belt is an advantage
-Strong customer focus, proactive and able to work within minimum supervision
-Creative in new ideas and solutions
-Good interpersonal and liaison skills in cross-functional team
-Good command of written and spoken English . Putonghua is an advantage

About NXP

NXP Semiconductors provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power, Digital Processing and manufacturing expertise. These innovations are used in a wide range of automotive, industrial, consumer, lighting, medical, computing and identification applications. Headquartered in Europe, the company has about 28,000 employees working in more than 25 countries and posted sales of USD 3.8 billion in 2009. News from NXP is located at www.nxp.com.

关于恩智浦半导体
恩智浦半导体以其领先的射频、模拟、电源管理、接口、安全和数字处理方面的专长，提供高性能混合信号（High Performance Mixed Signal）和标准产品解决方案。这些创新的产品和解决方案可广泛应用于汽车、智能识别、无线基础设施、照明、工业、移动、消费和计算等领域。公司总部位于欧洲，在全球超过25个国家拥有28,000名员工，2009年公司营业额达到38亿美元。更多恩智浦的新闻请访问网站www.nxp.com