上海招聘

Job Responsibilities:

• Implement error proof design or system installations to minimize production excursion and yield up and improve safety while being cost efficient.
• Working for QFP/QFN Molding process development and improvements on yield and quality .
• Coordinate EOL UPH projects by modifying the tooling or equipment .
• Be able to analyze this data to drive continuous improvement in equipment and process performance.
• Lead a team to design and conduct experiments throughout product manufacturing stages to characterize engineering process windows.
• Confer with cross-functional teams to solve technical issue and quality improvement.
• Drive continuous improvements in QFP/QFN Package product safety, efficiency, yield, cost, and manufacturability.
• Utilize statistical process controls, semiconductor process controls and equipment, metrology and support equipment.
• Qualify new material and equipment to meet process requirement and
• manage CCB ( VE/Improvements/Customer or supplier change)

Qualification:

• Minimum bachelor's degree Major in Mechanical or Engineering with a minimum of 3 years package Mold equipment/process experience in IC assy plants or tooling design /manufacture experience in automatic industry .
• Good tooling design and manufacture experience/ communication skills in English / Engineering data analysis skill
• Responsible for QFP/QFN Mold process engineering, equipment performance, working to insure production quality/yield/output.
• Work with cross function team to meet assigned process engineering, production and value engineering and quality metrics.

       星科金朋公司是世界排名前列的半导体封装测试公司，提供全球各地客户整体与快捷的高质量服务。客户群包括数家晶圆代工厂、全球知名IDM大厂与遍布全球各地集成电路设计公司。服务产品种类含盖通信、电脑、电源供应器与数据型消费性产品等。以先进制造与管理技术为基础，加上全球性布局，星科金朋在全球封装测试业树立了可靠与高质量服务的标竿。星科金朋公司在全球拥有一万多名员工，在新加坡、中国及中国台湾地区、韩国、马来西亚和美国等地设有工厂。
星科金朋（上海）有限公司位于上海西郊经济技术开发区，距虹桥机场仅8公里之遥，现有员工三千多人，占地面积11万平方米。公司提供定期和不定期的员工海外培训机会，为员工的发展提供广阔的平台。

公司将根据资历和相关工作经验对应聘成功者提供具有竞争力的薪金和福利，及相应的国内外培训机会。
凡有意应聘者请将详细的个人简历、学历证书、身份证及有关材料复印件邮寄、电子邮件或传真至本公司（请在信封/Email上注明应聘职位）。
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