封装前道工程师
优特半导体（上海）有限公司 UTAC (Shanghai) Co., Ltd.
- 公司规模：500-1000人
- 公司性质：外资(非欧美)
- 公司行业：电子技术/半导体/集成电路
职位信息
- 发布日期：2014-08-17
- 工作地点：上海-浦东新区
- 招聘人数：1
- 工作经验：3-4年
- 学历要求：大专
- 语言要求：英语良好
- 职位月薪：面议
- 职位类别：半导体技术
职位描述
Primary Responsibility基本职责 | |
1. Machine and tooling specification review and design 设备和治具规范审阅和设计 2. Maintain and enhance machine performance in terms of MTBA, MTTR thru PM activities and key projections 通过预防措施和关键项目，维持和加强设备的性能，例如MTBA, MTTR 3. Improve equipment UPH with high quality outputs 提升机器的UPH以产出更多好品 4. Improve in-process quality control, assembly process yield and productivity 改善内部品质控制，封装工艺良率和生产力 5. Optimize and simplify process flow to reduce total cost of ownership for IC packaging 优化和简化工艺流程，减少封装成本 6. Review and fine-tune assembly related spec like FMEA, OCAP, control plan, WI. 审阅和更新封装相关的规范，例如FMEA, OCAP, CP，WI 7. To accept and execute for any other special tasks, assignments or ad-hoc requirements ordered by line manager. 接受并执行上级领导布置的其他特殊任务、工作或者临时安排的工作要求 | |
Qualification / Skills / Experience Requirements 学历/技能/经验要求 | |
1. Degree or diploma in Electrical/Mechanical/Material Engineering 本科/大专，电气/电子/机械工程学位 2. Experience in semiconductor industry at least 5 years 至少5年半导体行业经验 3. Rich skills in assembly line sustaining and development 有丰富的经验在封装产线维护和改进方面 4. Familiar with basic engineering kits like SPC, DOE, QC 7 tools, 8D 熟悉基本的工程知识，例如SPC, DOE, QC 7 tools, 8D 5. Knowledge of Die Attach,Wirebond 懂Die Attach, Wirebond相关知识 6. Fluent in English 英语流利 7. Self-motivated and self-management 具有进取心并能自我管理 8. Work independently 能够独立工作 9. Willing to learn and develop 愿意学，有上进心 | |
公司介绍
United Test and Assembly Center Limited (UTAC) is a famous enterprise based in Singapore among the world's larger chip testing and packaging enterprises; UTAC Shanghai is the UTAC's subsidiary company settled down in Waigaoqiao Free Trade Zone in Shanghai. In accordance with the requirement of Chinese market, UTAC Shanghai has developed the strategy of CMW - the application of Consumes Electronic, Memory and Wireless.
随着公司业务的迅速发展，优特公司诚聘精英加盟。目前着重招募各类半导体封装与测试技术类人才（前段和后段），公司将为您提供良好的薪资、福利、在职培训及充分施展个人才华的空间。应聘者请将您的中英文简历和照片邮寄或E-mail到公司人力资源部。请在信封、简历和mail中注明您所应聘的职位。
With rapid expansion and business development, we are invites qualified, high caliber and self-motivated individuals for the following positions in Shanghai. Now we are focus on VACANCIES IN ASSEMBLY IN FRONT-OF-LINE AND END-OF-LINE. We offer competitive remuneration package，OJT training and good opportunities to successful candidates. Please send your detailed English resume and Chinese version with salary expectation to us.
联系方式
- 公司地址：上班地址：外高桥自贸区德堡路