上海招聘

KEY JOB DUTIES & RESPONSIBILITIES:
1.Develop assemble process/manufacture platform for photo-electric components products and package;
2.In depth knowledge in adhesive application, inductance soldering;
3.Prepare and update the process engineering documents such as process-flow chart, PFMEA, work instruction and etc.
4.To perform fault data analysis and provide recommendation and follow-up actions.
5.Improve cycle time on machines performance.

SKILLS/QUALIFICATIONS :
1. Bachelor Degree or above in Material Engineer, Seconductor or related engineering discipline.
2. Minimum 3-5 years relevant experience in Semiconductor manufacturing, die bonding, wire bonding process;
3. Experience in adhesive application and qualification;
4. Experience in trouble shooting and serving of die bonding machinery/equipments.
5. Be familiar with SPC, DFMEA/PFMEA, Process Failure Analysis and DOE;
6. Some design experience for process tooling/fixture using Soldworks or Auto- CAD is preferred
7. Good in spoken and written Chinese and English.

II-VI公司是全球领先的工程材料和光电子器件制造商。作为一家垂直一体化的公司，其为通信、材料加工、半导体材料设备、生命科学、消费电子和汽车等市场开发多样化应用的创新产品。公司总部位于美国宾夕法尼亚州萨克森堡，在全球拥有研发、制造、销售、服务和分销等中心。该公司生产各种特定用途的光子和电子材料及组件，并以各种形式有效利用它们，包括集成先进的软件来支持我们的客户。II-VI高意研发中心遍布全球多个城市，其中芯片的研发和生产主要位于美国、英国、瑞士等。半导体激光器在瑞士和英国都有研发中心；光收发模块的研发中心主要在美国Fremont和中国上海；其他光器件产品以及光学平台的研发则主要在中国上海和福州。