上海招聘

工作地点：苏州

Job Description

1. Development and evaluation of electrical circuits
开发与评估电气线路

2. Perform circuit integration, circuit/system levels testing and optimization
开展电路集成的操作，电路/系统水平的测试和优化

3. Test, analyze, root cause and resolve issues and failures of design
测试并分析系统中存在的设计缺陷，找出根本原因并提出相应的解决方案

4. Provide build support and analysis of PCBA pertaining to Electrical circuit design during Prototype phase
在PCBA电气电路设计的原型阶段提供相关的技术支持与系统分析

5. Participate in development and evaluation of audio, electrical, baseband, radio frequency circuits and subsystems for mobile devices and portable applications.
参与用于移动设备和便携式应用中的音频，电子，基带，射频集成电路以及子系统的开发，并进行相关的分析与评估

6. Make decision on sub-circuit, circuit and system design when needed
在必要时，决定子电路，电路和系统设计的方案

7. Provide technical recommendation based on cost and make improvements to the design
根据生产成本提供相匹配的技术建议，同时不断改善其设计

8. Work with a team of engineers and/or designers from different disciplines through different phases of the product development
与来自不同领域的工程师和/或设计师组成团队，参与产品开发的各个阶段

9. Provide guidance and mentor to junior engineers
为初级工程师提供技术指导与支持

10. Work closely with Singapore design centre for subsystem and system level testing and optimization
在子系统和系统的阶段测试和优化上与新加坡设计中心开展紧密合作

11. Support prototype builds and provide first hand analysis data to Singapore Design Centre
为新加坡设计中心提供原型构建的技术支持，并提供一手的数据分析

Specific Knowledge/Skills

1. Degree in Electrical/Electronics/Communication Engineering.
电气/电子/通讯工程相关专业学士学历

2. Hands-on experience in design/test of baseband and/or power management or RF circuit is required.
基带设计与测试、射频集成电路、电源管理相关实际经验

3. Knowledge of baseband system integration for display, imager, battery system, memory and processors are desired.
了解显示屏、成像器、电池系统，存储器以及处理器的系统集成

4. Analytical, independent, highly energized and able to communicate in English.
良好的英语沟通能力，善于独立分析和解决问题，对工作充满热情

赫比国际有限公司成立于1980年，是涉足机电模具、通讯业、消费电子和计算机业的领先供应商。我们多元化的服务涉及工业和产品设计，制造，组装以及配套增值服务如表面处理的精加工、外包制造以及精密金属冲压。

赫比公司的总部位于新加坡，全球共拥有15处工厂和技术支持中心。现有约20,000名雇员服务于赫比公司。

如果您希望了解更多的信息，欢迎登陆我们公司主页************


Founded in 1980,Hi-P is a leading supplier of electro-mechanical modules to the telecommunications, consumer electronics and computing industries. Our diversified service offering ranges from industrial and product design, manufacture, assembly, ancillary value –added services such as surface decoration finishing and precision metal stamping as well as turnkey contract manufacturing.

Headquartered in Singapore, Hi-p has an extensive footprint with 15 manufacturing plants globally and engineering-support centers. We currently employ about 20,000 people.

For more information, please review our website: ************