上海招聘

Job Description 职位描述
1. Participate in design and development of baseband or RF circuit for mobile devices and applications.
参与移动通信设备基带和射频电路的设计与研发；
2. Perform circuit integration, schematic generation and circuit/system levels testing and optimization.
熟悉电路集成，原理图设计以及电路/系统级测试与优化；
3. Define circuit specifications and test requirements.
定义电路的规格及测试要求；
4. Work with a team of engineers and factory NPI through different phases of the product development.
在项目各阶段，确保与研发团队及工厂项目团队的良好协作；
5. Support factory builds and failure analysis of prototypes.
协助工厂试产及工程机的故障分析
6. Work closely with Hi-P Singapore Design Centre.
与新加坡研发中心紧密合作

Specific Knowledge/Skills 知识与技能要求
1. Degree in Electrical/Electronics/Communication Engineering.
电气/电子/通讯工程相关专业学士学历；
2. Hands-on experience in design/test of baseband and/or power management or RF circuit is required.
基带设计与测试、射频集成电路、电源管理相关实际经验
3. Knowledge of baseband system integration for display, imager, battery system, memory and processors are desired.
了解显示屏、成像器、电池系统，存储器以及处理器的系统集成
4. Analytical, independent, highly energized and able to communicate in English.
良好的英语沟通能力，善于独立分析和解决问题，对工作充满热情

赫比国际有限公司成立于1980年，是涉足机电模具、通讯业、消费电子和计算机业的领先供应商。我们多元化的服务涉及工业和产品设计，制造，组装以及配套增值服务如表面处理的精加工、外包制造以及精密金属冲压。

赫比公司的总部位于新加坡，全球共拥有15处工厂和技术支持中心。现有约20,000名雇员服务于赫比公司。

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Founded in 1980,Hi-P is a leading supplier of electro-mechanical modules to the telecommunications, consumer electronics and computing industries. Our diversified service offering ranges from industrial and product design, manufacture, assembly, ancillary value –added services such as surface decoration finishing and precision metal stamping as well as turnkey contract manufacturing.

Headquartered in Singapore, Hi-p has an extensive footprint with 15 manufacturing plants globally and engineering-support centers. We currently employ about 20,000 people.

For more information, please review our website: ************