SH0149 TD SOC Engineer-Manager
中芯国际集成电路制造(上海)有限公司
- 公司规模:10000人以上
- 公司性质:外资(非欧美)
- 公司行业:电子技术/半导体/集成电路
职位信息
- 发布日期:2013-07-11
- 工作地点:上海-浦东新区
- 招聘人数:若干
- 工作经验:二年以上
- 学历要求:硕士
- 语言要求:英语良好
- 职位类别:电子技术研发工程师 信息技术经理/主管
职位描述
TD SOC Engineer(Power)
Job Purpose
PIE Engineer for SOC Ultra HV project (High Voltage BCD and High Voltage Discrete Device).
Job Responsibility:
1.SOC Ultra HV Integration,
2.Device design,
3.In-line process tuning,
4.WAT /RE test and analyze.
5.Good ability of research and communication
Job Requirements:
1.Master degree.
2.Integration working experience >3 years
TD SOC Engineer~Manager (Power)
Job Purpose
Develop MTE project
Job Responsibility:
Join and deliver MTE (Mutual Technology Enhancement) project.
Job Requirements:
Education or Working Experience:
1.BS and MS in EE, Mat Sci, Physics
2.BS with >8 year or MS with >6 or Ph.D. >4 year 3.Solid experience in semiconductor development or manufacturing, at least for 2 different generation. (e.g.0.18um/0.13um/0.11um/90nm/65nm/55nm.)
Core Competencies:
1.Creative ideal/thinking and executive ability
2.Competent interpersonal and leadership skills effective in a large organization
3.Overcome challenge ambition with high self-confidence Managerial Competencies: Should have good managerial competencies: Build Trust, Motivate Team member.
Professional Competencies:
1.Knowledge of CMOS device structures and characteristics, process technology, product eng
2.Specialized understanding of particular devices and process concepts as well as characterization plus competent oversight of developing the complete foundry portfolio of assigned particular devices and process technology.
TD SOC Engineer(CIS)
Job Purpose
1.Development of CIS technologies, especially BSI technology development.
2.Take responsibility for device tuning, data analysis and yield improvement.
3.Take responsibility for lot handing and process integration.
Job Responsibility:
1.Development & maintain new processes and take responsibility for project schedule making and tracing to on time delivery.
2.Co-work with Module PE or tool vendor to find out solution paths for process setup issues.
3.Patent, paper research for new technology feasibility study or issue trouble shooting.
4.WAT, CP data analysis & yield improvement. 5.Transfer technology process to FAB PIE.
Job Requirements:
1.Master degree
2.At least 2 years experience
3.May need to support project setup at Wuhan Fab
TD SOC Senior Manager ~ Assistant Direct (Embedded NVM)
Job Purpose
1.As Dep. Head's proxy, to lead & enforce 8" eNVM project development, including bank-card, smart-card, MCU, standard memory, Logic-NVM... etc.
Job Responsibility:
1.Supervise 8" eNVM (eEEPROM / eFlash) development.
2.Supervise 8" Logic-NVM enhancement (support Fab)
3.Serve as the team's eNVM expert, to lead the technology benchmark & enhancement.
4.Deliver competitive NVM technologies.
Job Requirements:
Education or Working Experience:
1.BS and MS in EE, Mat Sci, Physics or ME (minimum)
2.BS with >12 year or MS with > 10 or Ph.D. > 8 year
3.Solid experience in NVM development & manufacturing, at least for 3 different technologies. ( e.g. EEPROM, ETOX Flash, Split-Gate Flash, NAND, Logic-NVM, etc)
Core Competencies:
1.Strong project planning and management skills in a multiple tasks environment.
2.Competent interpersonal and leadership skills effective in a large organization
3.Proficient verbal and oral communication skill in English Managerial Competencies: Should have good managerial competencies: Build Trust, Motivate Employees, Develop Employees and Delegation & Empowerment
Professional Competencies:
1.Proficient knowledge of NVM and CMOS device structures, process technology, electrical characteristics and characterization 2.Specialized understanding of particular devices and process concepts as well as characterization plus competent oversight of developing the complete foundry portfolio of assigned particular devices and process technology
TD SOC Engineer(MEMS&TSV)
Job Purpose
Under supervision and guidance of program manager, involve and drive the design, development and implementation of SMIC MEMS, TSV and IPD project per the defined timeline and budget.
Job Responsibility:
1.To define devices structure and basic physical/parametric requirement,
2.To construct process flow and EDC spec for MES setup and Fab implementation,
3.To coordinate with module process engineers and resolve process issues.
4.To design test-key, provide guideline for layout, and review test-key/product database,
5.To develop DOE plan and handle intermediate in-line/off-line process issues/problems
6.To perform parametric testing and intermediate level device analysis 7.To coach and peer advise junior PIE in technical knowledge and hands-on skills
Job Requirements:
1.Bachelor Degree is required(Mat Sci, Chemistry, Chem Eng, or EE)
2.Good English language skills 3.At least 2 years experience, PIE or module process engineering
Job Purpose
PIE Engineer for SOC Ultra HV project (High Voltage BCD and High Voltage Discrete Device).
Job Responsibility:
1.SOC Ultra HV Integration,
2.Device design,
3.In-line process tuning,
4.WAT /RE test and analyze.
5.Good ability of research and communication
Job Requirements:
1.Master degree.
2.Integration working experience >3 years
TD SOC Engineer~Manager (Power)
Job Purpose
Develop MTE project
Job Responsibility:
Join and deliver MTE (Mutual Technology Enhancement) project.
Job Requirements:
Education or Working Experience:
1.BS and MS in EE, Mat Sci, Physics
2.BS with >8 year or MS with >6 or Ph.D. >4 year 3.Solid experience in semiconductor development or manufacturing, at least for 2 different generation. (e.g.0.18um/0.13um/0.11um/90nm/65nm/55nm.)
Core Competencies:
1.Creative ideal/thinking and executive ability
2.Competent interpersonal and leadership skills effective in a large organization
3.Overcome challenge ambition with high self-confidence Managerial Competencies: Should have good managerial competencies: Build Trust, Motivate Team member.
Professional Competencies:
1.Knowledge of CMOS device structures and characteristics, process technology, product eng
2.Specialized understanding of particular devices and process concepts as well as characterization plus competent oversight of developing the complete foundry portfolio of assigned particular devices and process technology.
TD SOC Engineer(CIS)
Job Purpose
1.Development of CIS technologies, especially BSI technology development.
2.Take responsibility for device tuning, data analysis and yield improvement.
3.Take responsibility for lot handing and process integration.
Job Responsibility:
1.Development & maintain new processes and take responsibility for project schedule making and tracing to on time delivery.
2.Co-work with Module PE or tool vendor to find out solution paths for process setup issues.
3.Patent, paper research for new technology feasibility study or issue trouble shooting.
4.WAT, CP data analysis & yield improvement. 5.Transfer technology process to FAB PIE.
Job Requirements:
1.Master degree
2.At least 2 years experience
3.May need to support project setup at Wuhan Fab
TD SOC Senior Manager ~ Assistant Direct (Embedded NVM)
Job Purpose
1.As Dep. Head's proxy, to lead & enforce 8" eNVM project development, including bank-card, smart-card, MCU, standard memory, Logic-NVM... etc.
Job Responsibility:
1.Supervise 8" eNVM (eEEPROM / eFlash) development.
2.Supervise 8" Logic-NVM enhancement (support Fab)
3.Serve as the team's eNVM expert, to lead the technology benchmark & enhancement.
4.Deliver competitive NVM technologies.
Job Requirements:
Education or Working Experience:
1.BS and MS in EE, Mat Sci, Physics or ME (minimum)
2.BS with >12 year or MS with > 10 or Ph.D. > 8 year
3.Solid experience in NVM development & manufacturing, at least for 3 different technologies. ( e.g. EEPROM, ETOX Flash, Split-Gate Flash, NAND, Logic-NVM, etc)
Core Competencies:
1.Strong project planning and management skills in a multiple tasks environment.
2.Competent interpersonal and leadership skills effective in a large organization
3.Proficient verbal and oral communication skill in English Managerial Competencies: Should have good managerial competencies: Build Trust, Motivate Employees, Develop Employees and Delegation & Empowerment
Professional Competencies:
1.Proficient knowledge of NVM and CMOS device structures, process technology, electrical characteristics and characterization 2.Specialized understanding of particular devices and process concepts as well as characterization plus competent oversight of developing the complete foundry portfolio of assigned particular devices and process technology
TD SOC Engineer(MEMS&TSV)
Job Purpose
Under supervision and guidance of program manager, involve and drive the design, development and implementation of SMIC MEMS, TSV and IPD project per the defined timeline and budget.
Job Responsibility:
1.To define devices structure and basic physical/parametric requirement,
2.To construct process flow and EDC spec for MES setup and Fab implementation,
3.To coordinate with module process engineers and resolve process issues.
4.To design test-key, provide guideline for layout, and review test-key/product database,
5.To develop DOE plan and handle intermediate in-line/off-line process issues/problems
6.To perform parametric testing and intermediate level device analysis 7.To coach and peer advise junior PIE in technical knowledge and hands-on skills
Job Requirements:
1.Bachelor Degree is required(Mat Sci, Chemistry, Chem Eng, or EE)
2.Good English language skills 3.At least 2 years experience, PIE or module process engineering
公司介绍
中芯国际集成电路制造有限公司(“中芯国际”,纽交所代号:SMI,港交所股份代号:981),是世界领先的集成电路晶圆代工企业之一,也是中国内地技术***面、配套最完善、规模***、跨国经营的集成电路制造企业,提供0.35微米到28纳米不同技术节点的晶圆代工与技术服务。中芯国际总部位于上海,拥有全球化的制造和服务基地。 在上海建有一座300***晶圆厂和一座200***晶圆厂;在北京建有一座300***晶圆厂和一座控股的300***先进制程晶圆厂;在天津和深圳各建有一座200***晶圆厂;在江阴有一座控股的300***凸块加工合资厂;在意大利有一座控股的200***晶圆厂。中芯国际还在美国、欧洲、日本和中国台湾地区设立行销办事处、提供客户服务,同时在香港设立了代表处。详细资讯请参考中芯国际网站*************。
联系方式
- 公司地址:上海市浦东新区张江路18号 (邮编:201203)