上海招聘

Job Purpose

1. To take responsibility for daily mask tape-out OPC data work;

2. Wafer level experiment for OPC and related RET technologies for advanced Lithography/ Patterning process.

Job Responsibilty

1. Clearly knows Module Target spec for different technology nodes;

2. Collect high quality OPC wafer data and do data analysis;

3. Realize wafer level experiment for RET development;

4. Modeling the process parameters and verify the model quality;

5. Through wafer level check to do Post OPC verification;

6. Summarize documents of process development procedure;

7. Familiar SMIC tape-out system and related documents;

8. Follow the O.I. to handle the daily tape-out work and perfect the O.I.;

9. Submit Patents and public papers;

Job Requirements

1. BS or MS in EE, Math, CS, Physics, or material science.

2. One plus years experience in semiconductor industry will be better.

3. Customer Service Oriented attitude.

4. Good Communication skills and Teamwork spirit.

5. Innovation & Continuous Improvement attitude.

6. Basic knowledge of semiconductor process technology, especially the lithography process.

7. Familiar with Unix/Linux system and relative EDA tools

8. Skillful in metrology equipment applications (CD-SEM)

9. Fundamental programming skill will be helpful

10.Strong written and verbal communication skills in both Chinese and English.

11.Understanding design rule, circuit layouts.

12.Strong computer application skills.

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