上海招聘

职责：
基于硅片上的滤波器、耦合器、巴伦、功率分配器、双工器,以及片上电阻、电容和电感等射频集成无源器件设计、建模、封装、测试。

要求：
精通硅衬底上射频无源器件的集成化、小型化设计；
熟练使用电路分析软件Cadence Virtuoso和ADS，熟练使用电磁场分析软件ADS Momenturm和HFSS;
了解无线通信系统及系统对各无源器件指标要求；
熟练使用探针测试台和矢量网络分析仪进行射频芯片及封装的测试等；
熟悉IPD设计和射频芯片的flipchip和wirebond等封装形式尤佳。

Responsibility：
Design, simulate and characterize on-chip passvie components, including inductors, capacitors, filters, diplexers, and baluns for applications in wireless communication modules and other microelectronics.
Design test-fixtures for passive components at chip and package level measurement with VNA.
Work with IC foundry and packaging companies to carry out passive component design and manufacture.

Requirements:
Be familiar with circuit simulation tools such as Cadence Virtuoso and ADS
Be familiar with electromagnetic simulation tools such as ADS Momentum and HFSS
Knowledge of wireless architecture and design spec for each subsystem
Knowledge of circuit, transmission line and EM theory and RF/microwave design techniques
The experience on the IPD design with wirebond or flipchip packaging will be a plus.

芯禾科技（xpeedic technology, inc.）创立2010年，致力于成为国内最好的面向世界的高性能电子设计自动化软件和设计服务的供应商。芯禾科技的创业团队包括电子设计自动化和光电设计业界有着丰富创业经验的***专家，他们已经在高速电路、无线射频、 数模混合电路、集成电路、封装设计等领域提供高质量的软件产品和设计服务。芯禾科技目前有风险投资公司的资金支持。

xpeedic technology, inc. was founded in 2010 by a team of industry experts to provide high performance eda software and differentiating electronic design engineering services. xpeedic is helping customers in the area of high speed digital designs, ic package designs, and rf analog mixed-signal designs. our engineering team has extensive experience in developing industry-leading eda software and has a proven track record for successfully delivering engineering service projects.
the company is backed by venture capital funding.