上海 [切换城市] 上海招聘

Sr. PCB DFM Engineer

菲尼萨光电通讯（上海）有限公司

  • 公司规模：500-1000人
  • 公司性质：外资(欧美)
  • 公司行业：通信/电信/网络设备

职位信息

  • 发布日期：2021-06-03
  • 工作地点：上海-闵行区
  • 招聘人数：若干人
  • 工作经验：5-7年经验
  • 学历要求：硕士
  • 语言要求：英语良好
  • 职位月薪：20-30万/年
  • 职位类别：PCB工程师

职位描述

KEY JOB DUTIES & RESPONSIBILITIES:


  1. Critical member of II-VI’s Global DFM Engineering team. Share in the generation of rigid or flex PCB stackups including all impedance calculations, material specifications, drill parameters, etc. for the LSR.
  2. Answering Technical Questions (TQ’s) for designs from Shanghai, WUXI, IPOH, and Singapore, with the II-VI road map for organic substrates in mind. Occasional backup during the absence of other team members.
  3. Execute the Supplier Notice (SN) process within Agile within a timely manner for job continuity and efficiency.
  4. Work closely with PCB Fabricators, Design Engineers, Layout Engineers, & the DFM team to close out issues.
  5. Participate in the PCB and Flex technology road mapping team, research options for next steps, etc.
Research PCB/FLEX technology for next-generation organic substrate development

SKILLS & QUALIFICATIONS:

(Include Education, Skills & Experience)

  1. Excellent communication skills with Fabricators, Design Engineers, Layout Engineers, & the DFM team to quickly close out issues.
  2. In Depth Knowledge of the fabrication process of Rigid & Flex PCB Circuits (Lay-up, Lamination, Mechanical and Laser Drilling, Plating, etc.)
  3. In Depth knowledge of High-Density Interconnect (HDI) and its associated design rules.
  4. Ability to derive a balanced design to satisfy manufacturability and project goals such as performance & density.
  5. Proficient in the Agile revision control, supplier notice, and release process.
  6. Familiar with PCB and Flex technology dielectric materials, adhesives and process options such as Subtractive Plating, Semi-Additive Plating, via options such as ALIVH, ELIC, Sintering, Surface Finishes, etc.).
  7. Skillful to operate Cadence Allegro, along with strong skills in designing high speed, multi-layer, HDI, Analog/RF layout and power supply layout
  8. Hands-on layout experience on FPGA, DSP ARM processor, Serdes, PCIe5.0, DDR3/4, 400GE, NRZ/PAM4 signals routing preferred.
  9. Demonstrable knowledge of design for SI/PI, EMI, EMC, ESD and safety regulation
  10. High speed I/O and transmission line design theory will be strongly preferable
  11.  Good knowledge of IPC specifications, PCB manufacturing and assembly process
  12. Hands-on experience with different PCB materials and understanding cost/performance trade-off

职能类别：PCB工程师

公司介绍

II-VI公司是全球领先的工程材料和光电子器件制造商。作为一家垂直一体化的公司，其为通信、材料加工、半导体材料设备、生命科学、消费电子和汽车等市场开发多样化应用的创新产品。公司总部位于美国宾夕法尼亚州萨克森堡，在全球拥有研发、制造、销售、服务和分销等中心。该公司生产各种特定用途的光子和电子材料及组件，并以各种形式有效利用它们，包括集成先进的软件来支持我们的客户。II-VI高意研发中心遍布全球多个城市，其中芯片的研发和生产主要位于美国、英国、瑞士等。半导体激光器在瑞士和英国都有研发中心；光收发模块的研发中心主要在美国Fremont和中国上海；其他光器件产品以及光学平台的研发则主要在中国上海和福州。

联系方式

  • Email：recruitment@finisar.com
  • 公司地址：地址：span陈行公路2168号临港浦江国际科技城内浦江智慧广场11A