上海招聘

Responsibilities:

1. Arrange internal and external FA reports, and ensure there is as less delay as possible ;

2. Optimize the FA procedure, evaluate new FA method and integrate available items into general FA procedure ;

3. Improve FA methods if possible related to quality and/or efficiecy increse with considering the cost topic ;

4. New  FA equipment evaluation,  installation and qualification ;

5. Communicate and cooperate with Maintenance, Facility, IT and supplier for related maintenance and service ;

6. Update the documents, ensure all of them are efficient and keep the harmonization with actual operation ;

7. Update training documents related to FA, train FA team and related department ;

8. Finish required reports to superior as timely agreed without delay  ;

9. Work and emphasize proffessional and objective communication to within lab and external lab employee ;

10. Support lab external projects with best know how as assigned by superior ;

11. Implement the cost saving topic into the daily work, well plan ressources ***/material/machine, avoid and improve inefficient processes ;

12. Manage related technician attendance ;

13. Ensure environmental and safety ;

14. Train and qualify new technicians based on superior order.

Requirements:

1. A wide range of failure analytic know how of tools and methods to ensure highest quality level analysis for root cause finding. From the start as failure observation and failure analysis plan until final report with root cause identification; highest FA skills can lead to success.

2. Experience in semiconductor die attach/mount assembly process and quality/audit; experience with expert knowledge in related key process field. Capability build up and qualification of DA process at new designs, recipe definition, yield improvements, Develop and improve methods related to die attachment or DA related process steps.

3. Experience in know-how and failure mode of substrate and substrate-like-PCB process.

4. Experience in related FA tool : SEM,EDX, FIB, Ion milling, FTIR, cross section, ELITE Hot spot, iTDR, 3D x-ray.

  

  

  

奥地利科技与系统技术股份公司(简称：奥特斯)是全球领先的高端印制电路板制造商，特别是在高端HDI微孔互联印制电路板领域，奥特斯拥有全球领先的技术与市场地位，其产品主要应用于移动设备，还广泛涉及汽车、工业、医疗电子领域。
作为一家迅速发展的跨国企业，奥特斯目前在奥地利本土和亚洲地区共拥有六个生产基地 - 奥地利：利奥本、菲岭；亚洲：印度南燕古德、韩国安山、中国上海、中国重庆(在建)。
奥特斯在中国已有十余年的发展历史。奥特斯（中国）有限公司是集团在中国设立的独资企业，项目于2001年由两国***元首在北京人民大会堂共同签署，截至目前累计总投资超过7亿美元，是迄今为止奥地利在华大的投资项目。公司的主要产品为HDI 高端印刷电路板，客户包括了许多全球领先的移动通讯设备厂商。奥特斯上海工厂现有员工超过4300人，根据中国印制电路协会统计，奥特斯上海工厂已发展成为全球大的HDI 高密度印制电路板制造基地。
奥特斯科技（重庆）有限公司是奥特斯集团在中国设立的第二家独资企业，项目于2011年3月启动，工厂将分三期建设，一期投资为4.47亿美元，预计2016年1月开始量产, 届时员工人数将达到1700人。奥特斯（重庆）有限公司生产的产品为高端半导体封装载板，客户为全球领先的半导体制造商。由于半导体封装载板的准入门槛极高，工厂建成后奥特斯将凭借极具竞争力的自身优势跃为全球仅有的三家、中国***的新一代高端半导体封装载板制造商。