研发工程师
上海熙邦应用材料有限公司
- 公司规模:50-150人
- 公司性质:民营公司
- 公司行业:电子技术/半导体/集成电路
职位信息
- 发布日期:2020-12-27
- 工作地点:上海-奉贤区
- 招聘人数:2人
- 工作经验:2年经验
- 学历要求:硕士
- 职位月薪:20-30万/年
- 职位类别:化工技术应用/化工工程师
职位描述
1、进行电子相关行业粘接剂、UV油墨、涂层的新产品的研发及工艺配方优化;
2、研发项目计划、立项报告,产品研发方案制定;
3、新产品工艺优化与试产
4、参与质量问题处理,编制检测报告。
5、有行业相关经验者优先
要求:
高分子或相关专业硕士及以上学历优先,有相关经验者的可放宽到本科学历;
良好的团队合作精神和沟通协调能力;
较强的学习能力和分析解决问题能力;
良好的团队意识和与人沟通能力;
男女不限
职能类别:化工技术应用/化工工程师
公司介绍
上海熙邦是一家专注于研发生产高端电子、光通讯用粘接与密封剂的高科技公司。公司在上海综合开发区设立研发、生产与营销中心,并在深圳和成都设立办事处。产品辐射全国并服务于国内多个行业的客户群体。为微电子、军工、航空航天和光通讯等领域提供成套的专业解决方案;特别在光通讯粘接剂行业开拓性开发系列单组份粘接剂。
公司通过与国外团队的多年来合作,掌握微电子与光通讯粘接剂国际前沿技术;建立完善的研发与质量控制体系;拥有快速响应和满足客户特殊定制需求的能力;提供完善的售前与售后技术支持的服务;为用户的产品稳定运行保驾护航。
SUP-BOND产品系列由环氧树脂,丙烯酸酯混合配方组成。提供可在室温、加热或紫外光下固化的单组份和双组分产品体系。
Shanghai SupBond is a high-tech company focus on research and production of high performance adhesives and sealants for electronic and optical communication industries. SupBond headquarter, R/D laboratories and Production are set up in “Shanghai Comprehensive Development Zone”. We also have offices in Shenzhen and Chengdu.
SupBond provides complete bonding solutions for microelectronics, military, aerospace and optical communication industries. Our newly developed a series of single-component adhesives is especially developed for the OEMs in the electronics and optical industries.
Through many years on the researches and cooperation with our customers, SupBond masters many cutting-edge technologies of adhesives. Our R&D provides customer formulation quickly. Our Production and QC provide stable and qualified products. Our Technical Service provides trouble shoot and other support.
The SUP-BOND product line consists of ambient and heat cure and UV curable and UV/heat combination cure adhesives. We also provided customer special formulations.
公司通过与国外团队的多年来合作,掌握微电子与光通讯粘接剂国际前沿技术;建立完善的研发与质量控制体系;拥有快速响应和满足客户特殊定制需求的能力;提供完善的售前与售后技术支持的服务;为用户的产品稳定运行保驾护航。
SUP-BOND产品系列由环氧树脂,丙烯酸酯混合配方组成。提供可在室温、加热或紫外光下固化的单组份和双组分产品体系。
Shanghai SupBond is a high-tech company focus on research and production of high performance adhesives and sealants for electronic and optical communication industries. SupBond headquarter, R/D laboratories and Production are set up in “Shanghai Comprehensive Development Zone”. We also have offices in Shenzhen and Chengdu.
SupBond provides complete bonding solutions for microelectronics, military, aerospace and optical communication industries. Our newly developed a series of single-component adhesives is especially developed for the OEMs in the electronics and optical industries.
Through many years on the researches and cooperation with our customers, SupBond masters many cutting-edge technologies of adhesives. Our R&D provides customer formulation quickly. Our Production and QC provide stable and qualified products. Our Technical Service provides trouble shoot and other support.
The SUP-BOND product line consists of ambient and heat cure and UV curable and UV/heat combination cure adhesives. We also provided customer special formulations.
联系方式
- 公司地址:地址:span南桥环城东路312号