上海招聘

Our Senior Sustaining Product Engineers are responsible for a variety of important and diverse work. Below are some of the highlights of the main responsibilities and duties:

? Lead a team of Sustaining Product Engineers in Asia to perform the functions below
? Bench vs. ATE data correlation
? Repeatability studies and yield analysis
? Package shift and guard-band limits analysis
? Work closely with Test Subcontractors, US Test Engineers to support and qualify Product Test Transfers to be released to production testing.
? Provide engineering production support by analyzing, monitoring and initiating actions to improve product yields and test time.
? Supports production ramp phase for products transferred offshore for production testing.
? Support/perform program, test platform conversion.
? Support yield enhancement.

Detailed Position Requirements:
? BSEE from an accredited institution or equivalent.
? Minimum of 5-10 years of recent “hands-on” experience in Product Engineering in a semiconductor environment or 5 years of test development of analog/mixed signal semiconductor products at both wafer probe and final test.
? At least 5 years of recent corporate experience in Product Engineering working with Test Development Engineers to develop Test SW/ HW to collect, analyze and evaluate data on new designs at package and wafer level.
? Must be familiar with and have a minimum of 3 years experience using at least two of the following testers:
a. ASL 1000
b. Eagle ETS-300/364B
c. UltraFlex is a strong plus
d. OR experience and understanding of similar semiconductor testers.
? Experience applying and understanding statistical process control (SPC) and capability analysis (CPK) to analyze data.
? Proficient “hands on” knowledge and skills in using standard lab equipment for evaluation and correlation; including: Power supplies (Hewlett Packard Model 34401A, Keithley Source Meter Model 24400, Oscilloscopes (Tektronix Model TDS 3054B).
? Effective verbal and written English skills with ability to prepare and present written data reports and present results to R&D and Operations team members.
? Ability to use computer with working knowledge of Microsoft suite of tools (Word, Excel, PowerPoint, Outlook).

上海美高森美半导体有限公司前身为上海电器股份有限公司与美国美高森美公司（Microsemi）合资组建的中外合资企业（简称SMSC），成立于1995年9月，公司注册资本为636万美元，投资总额1100万美元，2007年底成为美国独资公司，隶属于美国美高森美集团。
公司座落于上海市闵行区莘庄工业区申南路203号。
公司主要生产高可靠性大功率玻璃钝化整流管芯片（GPP）、瞬态电压抑制二极管芯片（TVS）、肖特基整流二极管（Schottky）及其它半导体器件和芯片。产品达到美国军用/航空二极管标准，广泛应用于移动通讯、通信、电脑及周边设备、医疗器械、数码相机、家电、汽车、军用/航空等领域。