上海招聘

Responsibilities:

• Explore new concepts and new opportunities before PIP1, together with the project teams
  
• Responsible for design and development of single channel and parallel optics active cable and transceiver products as well as bi-directional, tunable and other products.
  
• Explore new concepts and new opportunities before PIP1, together with the project teams
• Responsible for design and development of single channel and parallel optics active cable and transceiver products as well as bi-directional, tunable and other products. Be responsible for product transfer to Shanghai site of products designed and developed from other Finisar R&D sites.
• Participate in joint product design and development efforts with other R&D centers
• Do brain storming and initial studies to identify possible ways of designing a low cost high performance product suitable for high volume manufacturing in early product design phase
• Do design reviews in each of the New Product Introduction (NPI) phase from PIP0, PIP1, all the way to PIP4 and complete internal (Mechanical team) design reviews according to Mechanical Team Design Process prior to exit of each NPI phase
• Communicate with Shenzhen IPO to identify suitable vendors and best manufacturing ways such as plastic injection molding, zinc or aluminum die casting, sheet metal stamping, etc. for manufacturing of products after finalizing design and completing design reviews
• Create and maintain responsible product drawings at all phases of NPI and release product drawings to prototype or production lifecycle stage through ECO process
• Responsible for identifying and specifying critical to function (CTF) dimensions and inspection dimensions on the drawings for first article inspection (FAI), incoming quality control (IQC) and outgoing quality control (OQC)
• Responsible for qualifying piece parts, sub-assemblies and tooling for Alpha samples, Beta samples and productions by doing first article inspection of critical dimensions and review first article inspection reports from IQC departments and vendors
• Do necessary engineering analysis, simulations and testing in all NPI phases to validate the designs
  Leading and handling the mechanical test for design validation and failure analysis. Including dimension inspection, strength, stress and all other mechanical test, mechanical related optical test and hardware test to figure out the root cause of failure samples.
• Technique support for manufacturing plant, to resolve the mechanical related questions in the production line, to make the mass building in the good situation.
• Support thermal engineer to verify and develop the new technology of thermal dissipation, and new thermal materials.
  

Requirements: 

• Degree in Mechanical Engineering (BS with at least 8 years of relevant experience or MS with at least 5 years of relevant experience is preferred)
• Knowledge/experience in high volume fabrication processes including metal stamping, die casting and plastic injection molding
• Prior design experience in high volume products such as optical transceivers, cell phones, laptops, or other consumer products
• Proven track record of successfully developing/transferring products into high volume manufacturing including frequent interaction with manufacturing teams both as part of transfer activities and ongoing cost/yield improvements Proficiency with SolidWorks mechanical design software Expertise on dimensioning/tolerance, metrology, GD&T, and experience in FEA (incl. thermal simulation) is preferred Excellent communication, planning, organizational, & interpersonal skills
• Be good at assembling, molding, stamping, die casting, die cutting, plating, PCB fabrication, SMT, wire bonding and other related process technology. Be familiar with the designing for mechanical strength, thermal transferring, optical coupling, signal integrity(including EMI and ESD)
• Good English skill at writing and reading, basic skill at oral communication
• Eager to learn fresh things and willing to dig deeper High moral and integrity, as a good team player

II-VI公司是全球领先的工程材料和光电子器件制造商。作为一家垂直一体化的公司，其为通信、材料加工、半导体材料设备、生命科学、消费电子和汽车等市场开发多样化应用的创新产品。公司总部位于美国宾夕法尼亚州萨克森堡，在全球拥有研发、制造、销售、服务和分销等中心。该公司生产各种特定用途的光子和电子材料及组件，并以各种形式有效利用它们，包括集成先进的软件来支持我们的客户。II-VI高意研发中心遍布全球多个城市，其中芯片的研发和生产主要位于美国、英国、瑞士等。半导体激光器在瑞士和英国都有研发中心；光收发模块的研发中心主要在美国Fremont和中国上海；其他光器件产品以及光学平台的研发则主要在中国上海和福州。