上海招聘

Job Function

    

Identify and ensure internal and external reliability qualification requirements are incorporated into IP/product qualifications. Assure reliability targets are met for new design win. Manage qualification start to finish including board schematic design/layout, burn-in program verification during development. Lead root-cause analysis, corrective and preventative actions to address qualification failures and facilitate or participate in issues that arise on production released products. Directing, performing and/or coordinating with external labs to perform fault isolation to identify failure mechanisms(s). Perform electrical testing to aid in localizing electrical failures. Work with designers and engineering groups to isolate root cause of failures. Facilitate Potential Problem Analysis for IP/products and processes in development and R&D and Advanced Development activities. Qualify new technologies developed by R&D. Assure reliability targets are met. Evaluate and approve engineering change orders and supplier process change requests along with qualification of changes when required. Support reliability improvement activities through root-cause analysis of failures and evaluation of improvements. Support root cause analysis and corrective actions for customer and supplier issues. Define and drive product Ongoing Reliability Monitoring (ORM) projects Support Customer Quality with customer inquiries.

    

    

Qualifications

    

Master / Bachelor degrees

    

Must be very familiar with international REE related standards

    

Expert on HTOL, BHAST, uHAST, ESD test skills and debugging / FA capabilities

    

Expert on PKG level qualifications, including FCBGA and other PKGs

    

Strong PFA skills, including the electrical and mechanical characteristics of integrated circuits, components, packages, and field environments to determine the root cause of failure.

    

Be familiar with reliability related know-hows in chip design, including ESD, Latch-Up, etc.

    

Be familiar with foundry, assembly processes/failure modes/failure causes

    

Understanding of key OEM customer internal REE standards will be key asset

    

Experience of internal and 3rd party lab managements

    

Expert on project management and schedule tracking

    

Customer RMA engineering experience will be a strong asset

CREDO成立于2008年，是全球领先的半导体芯片设计公司，在上海、硅谷、香港、新竹、武汉、南京均设有分支机构。CREDO多年来致力于为数据中心、云、5G、超级计算等领域提供低成本、低功耗、最先进的超高速单通道112G/56G/28G连接商业解决方案，是全球屈指可数能在28nm/16nm/12nm/7nm全部工艺基础上实现400G/800G连接商业解决方案的公司，产品满足客户对成本、功耗、性能、上市时间、产能等多方位要求。
CREDO在主要产品及服务包括：Optical DSP、Linecard IC、AEC（有源电缆）、IP，深受国内外客户认可；服务的客户及产业合作伙伴包括但不限于国内外一流交换芯片 、 交换机 、通讯设备 、 测试仪表 、 光模块 、 超级计算等厂商。
随着公司发展，CREDO在行业的影响力日趋增长：曾获2017、2019年度台积电（TSMC）开放创新平台专业IP技术奖。公司是OCP成员企业，参与 IEEE 、 OIF 等标准的制定，也是HiWire 全球产业联盟发起人。HiWire 全球产业联盟是支持HiWire AEC（有源电缆）应用与发展的非营利组织，旨在促进高质量、可兼容的HiWire有源电缆AEC设备开发，建立HiWire AEC从研发、生产、测试到使用的行业生态系统，提高公众认知并激发终端用户对HiWire AEC使用需求。
CREDO集团目前在国内下设两家子公司：默升科技，为集团全球研发中心；芯境科技，取“芯”无止境之意，致力于为中国客户提供更及时周到的售前与售后服务，以支持中国系统厂商的快速发展。
CREDO已于2020年上半年完成来自国内外投资人的D轮融资，未来发展势头强劲。CREDO坚持“技术领先，以人为本”的经营理念，始终关注雇员健康与个人发展，欢迎海内外各类人才踊跃加入，与公司共同成长。