上海招聘

Requirement:
1.Master or Ph.D in Optics, Electronics, Mechanics, Automation and other related majors;
2.5+ years previous working experience in optical communication, semiconductor, automation, electronics, and related industries;
3.Familiar with the passive/active optical components and modules, such as DWDM, Isolator, VOA, DCF, EDFA, TODC, ROADM, Transceiver, Transponder, Pump Laser;
4.Strong problem-solving capabilities on process definition and optimization;
5.Familiar glue process, laser wilding process, Seam Sealing process, and EDS;
6.Team spirit and good interpersonal skills.
7.Have good managment skill.

Responsibilities:
1.Define the manufacturing process for the product which is in R&D phase;
2.Optimize and enhance the current processes running in current product lines.

Key Words:
Finisar, Isolator, WDM, Interleaver, Tosa, Rosa, Transceiver, Transponder, EDFA, Lind Card
菲尼萨光电通讯，波分复用器，梳状滤波器，光发射接收模块，信号放大器

Requirement:
1.Master or Ph.D in Optics, Electronics, Mechanics, Automation and other related majors;
2.5+ years previous working experience in optical communication, semiconductor, automation, electronics, and related industries;
3.Familiar with the passive/active optical components and modules, such as DWDM, Isolator, VOA, DCF, EDFA, TODC, ROADM, Transceiver, Transponder, Pump Laser;
4.Strong problem-solving capabilities on process definition and optimization;
5.Familiar glue process, laser wilding process, Seam Sealing process, and EDS;
6.Team spirit and good interpersonal skills.
7.Have good managment skill.

Responsibilities:
1.Define the manufacturing process for the product which is in R&D phase;
2.Optimize and enhance the current processes running in current product lines.

Key Words:
Finisar, Isolator, WDM, Interleaver, Tosa, Rosa, Transceiver, Transponder, EDFA, Lind Card

II-VI公司是全球领先的工程材料和光电子器件制造商。作为一家垂直一体化的公司，其为通信、材料加工、半导体材料设备、生命科学、消费电子和汽车等市场开发多样化应用的创新产品。公司总部位于美国宾夕法尼亚州萨克森堡，在全球拥有研发、制造、销售、服务和分销等中心。该公司生产各种特定用途的光子和电子材料及组件，并以各种形式有效利用它们，包括集成先进的软件来支持我们的客户。II-VI高意研发中心遍布全球多个城市，其中芯片的研发和生产主要位于美国、英国、瑞士等。半导体激光器在瑞士和英国都有研发中心；光收发模块的研发中心主要在美国Fremont和中国上海；其他光器件产品以及光学平台的研发则主要在中国上海和福州。