上海招聘

Key responsibilities:
? Develop assemble process/manufacture platform for photo-electric components products and package;
? Focus on epoxy bond process and manufacture platform including silver epoxy, non-conductive epoxy and UV glue etc for mass volume products;
? 3 to 5 years working experience in die bond assembly process/manufacturing;
? In depth knowledge in adhesive application, inductance soldering;
? Experience in trouble shooting and serving of die bonding machinery/equipments.
? Experience in OSA package is preferred.
? Prepare and update the process engineering documents such as process-flow chart, PFMEA, work instruction and etc.
? To perform fault data analysis and provide recommendation and follow-up actions.
? Improve cycle time on machines performance.

Qualifications:
1.Bachelor Degree or above in Material Engineer, Mechanical Engineering or related engineering discipline.
2.Minimum 3-5 years relevant experience in die bond process/manufacturing;
3.Experience in adhesive application and qualification;
4.Experience in trouble shooting and serving of die bonding machinery/equipments.
5.Be familiar with SPC, DFMEA/PFMEA, Process Failure Analysis and DOE;
6.Some design experience for process tooling/fixture using Soldworks or Auto- CAD is preferred
7.Experience in volume production as TO OSA or semiconductor package is preferred.
8.Good in spoken and written Chinese and English.
9.Good problem solving, interpersonal and analytical skills.

II-VI公司是全球领先的工程材料和光电子器件制造商。作为一家垂直一体化的公司，其为通信、材料加工、半导体材料设备、生命科学、消费电子和汽车等市场开发多样化应用的创新产品。公司总部位于美国宾夕法尼亚州萨克森堡，在全球拥有研发、制造、销售、服务和分销等中心。该公司生产各种特定用途的光子和电子材料及组件，并以各种形式有效利用它们，包括集成先进的软件来支持我们的客户。II-VI高意研发中心遍布全球多个城市，其中芯片的研发和生产主要位于美国、英国、瑞士等。半导体激光器在瑞士和英国都有研发中心；光收发模块的研发中心主要在美国Fremont和中国上海；其他光器件产品以及光学平台的研发则主要在中国上海和福州。