上海招聘

The process engineer is responsible for implementing of electrochemical deposition (ECD) and physical vacuum deposition (PVD) processes and providing technical support advanced IC packaging. This is a hands-on job with the requirements of understanding of ECD and PVD fundamentals, critical thinking and strong troubleshooting skills.

The process engineer is responsible for working with customers to successfully apply our tools in support of the fabrication of wafer scale electronic packages and wafer bumping processes. Specific duties include the following;

• Perform factory acceptance testing on ECD and PVD automatic process tools on-site customers’ facilities.

• Ensure that ASM NEXX tools at customer sites are running with the ASM NEXX products and Process Of Records (PORs) and qualified for customers’ products.

• Perform process engineering troubleshooting and problem solving. Identify process problems, effectively communicate with process teams in headquarter and follow up to implement solutions on customers’ sites.

• Investigate engineering problems during ECD and PVD process start up and product qualification;

• Work with ASM NEXX engineering to implement new Best Known Methods (BKMs) from headquarter engineering teams in ECD or PVD tools.

• Work with customers’ engineers to qualify ECD or PVD processes for their new products.

• Design and implement ECD or PVD process experimentation to support trouble shooting or new process development on customers’ sites.

• Review product requirements and specifications with customers, recommend process optimization to enhance yields, reduce costs and improve performance on ASM NEXX ECD and PVD tools.

• Prepare, monitor and maintain chemistry in ECD plating bath to optimize ECD processes.

• Analyze production and experimental data and write reports using statistical analysis results and technical understanding of the ECD or PVD processes.

Minimum Requirements: 

Bachelor degree in Chemical Engineering, Material Science or relating engineering fields. Plus 3 years of experience in process engineering in semiconductor industry.

• Demonstrated good written communication skill.

This position is located in Chong Qing.

    ASM Pacific Technology Ltd. (ASM太平洋科技有限公司，简称ASMPT) 是全球***的半导体和发光二极管 (LED) 行业的集成和封装设备供应商，为跨国芯片制造商、独立集成电路（IC）装配工厂、消费电子产品和LED制造商提供装配设备。
    ASMPT成立于1975年，1989年在香港上市（股票代码H0522），业务遍布全球30多个国家和地区，拥有员工约16000人。在中国香港、中国成都、中国台湾、新加坡、德国慕尼黑 及雷根斯堡 、英国韦茅斯 、荷兰布宁根 、葡萄牙波尔图 、美国比尔里卡 等地拥有卓越的科研中心，在中国的深圳龙岗、深圳宝安和惠州、中国香港以及新加坡、马来西亚、德国等地拥有先进的智造中心。于2002年成为行业***，在半导体集成和封装设备市场、SMT解决方案、射频应用市场等领域占据全球领先地位。于2011年收购德国西门子旗下SEAS业务进军表面贴装（SMT）领域。2014年收购英国DEK印刷机业务和荷兰ALSI激光技术。2018年，收购AMICRA Microtechnologies GmbH，使集团在光电子市场处于领先地位；收购东京电子有限公司 (TEL) 的 TEL NEXX (NEXX) ，融入集团的后工序设备业务分部。
    ASMPT拥有良好的雇主口碑，成功跻身2018全球科技公司100强，曾荣获“香港十佳投资者关系公司”、“香港十佳亚洲管理公司”、“客户最满意供应商”、“新加坡科技成就奖”、“2017年度杰出董事奖”、“香港杰出企业”等殊荣，三次获得香港工商业奖科技成就大奖。

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