上海招聘

Responsibility:

• Product Management with strong customer orientated focus. Finding the right application for the customer, based on requirements, technical solution and fully cost optimized.
• Implement customer project into AT&S and work as technical interface between AT&S (Design, Operation, Sales,…) and customers.
• Analysis of product requirements at customer project early stage, understand customer electrical design conceopt and provide techical suggestions/solutions to customer.
• Component level technical discussion with supplier,include Passive component,Active Die also wafer level service supplier.
• Project review and risk assessment.
• Make the error analysis with the team and come up with the solutions.
• Technical support to commercial department to develop business and satisfy customer.
• Own responsibility for further study on sector environmental protection.
• Other Job assignment from superior.

Requirements:

•   Bachlor degree or above of Electronics engineering

• Knowledge of components(passive+active), wafer level processes and surrounding packaging technologies and industries

• Knowledge of circuitry design for SiP (System in Package) , DSP, ASIC…

• Strong mind to understand customer applications and their requirements

• Knowledge of PCB manufacturing process,embedding technology would be plus

• Good stress management skills.

• Good analytical skills with meticulous attention to detail.

• Be able to work in/coordinate an international and multi functional team

• Integrated and interdisciplinary thinking and acting.

• Good communication skills.

• Fluent written and oral English.

• Good presentation skill

                        

奥地利科技与系统技术股份公司(简称：奥特斯)是全球领先的高端印制电路板制造商，特别是在高端HDI微孔互联印制电路板领域，奥特斯拥有全球领先的技术与市场地位，其产品主要应用于移动设备，还广泛涉及汽车、工业、医疗电子领域。
作为一家迅速发展的跨国企业，奥特斯目前在奥地利本土和亚洲地区共拥有六个生产基地 - 奥地利：利奥本、菲岭；亚洲：印度南燕古德、韩国安山、中国上海、中国重庆(在建)。
奥特斯在中国已有十余年的发展历史。奥特斯（中国）有限公司是集团在中国设立的独资企业，项目于2001年由两国***元首在北京人民大会堂共同签署，截至目前累计总投资超过7亿美元，是迄今为止奥地利在华大的投资项目。公司的主要产品为HDI 高端印刷电路板，客户包括了许多全球领先的移动通讯设备厂商。奥特斯上海工厂现有员工超过4300人，根据中国印制电路协会统计，奥特斯上海工厂已发展成为全球大的HDI 高密度印制电路板制造基地。
奥特斯科技（重庆）有限公司是奥特斯集团在中国设立的第二家独资企业，项目于2011年3月启动，工厂将分三期建设，一期投资为4.47亿美元，预计2016年1月开始量产, 届时员工人数将达到1700人。奥特斯（重庆）有限公司生产的产品为高端半导体封装载板，客户为全球领先的半导体制造商。由于半导体封装载板的准入门槛极高，工厂建成后奥特斯将凭借极具竞争力的自身优势跃为全球仅有的三家、中国***的新一代高端半导体封装载板制造商。