上海招聘

5. 配合质量、销售人员解决封测厂、终端客户生产过程中出现的问题;

JobTitle:

Responsibilities:
1. Responsible for packaging design of new products, evaluate the feasibility of various packaging, and design competitive packaging scheme for new products from the perspective of packaging quality, product performance and packaging cost;
2. Responsible for following up new products progress after wafer tape out and design、estimate and confirme the engineering and technical materials of new products;
3. Consider and solve problems of all production progress that may affect new production transfer to MP, such as processing stability, packaging materials, production capacity, etc;
4. investigate and survey advanced packaging technology, and make active suggestions to R&D team, and used for production;
5. Cooperate with quality、sales staff to solve the technical problem  in mass production phase.

任职要求：

1. 大学专科以上学历
2. 熟悉WB类、FC类或WLCSP类等任一封装工艺，需有至少一种封装工艺的PE或NPI一年以上的经验
3. 具有良好的沟通能力、分析问题能力、较强的协调能力，以及团队合作意识
4. 具有较强的质量意识、责任心和上进心
5. 有封装工厂或芯片设计公司的项目管理经验者优先

Requirements:

1. College education, bachelor degree better.
2. Be familiar with W/B or F/C or WLCSP packaging process, need at least 1 years experience in PE or NPI position;
3. Good communication skills, problem analysis ability, strong coordination ability and teamwork spirit;
4. Have strong senses of quality, responsibility and ambition;
5. Have project management experience in package factory or chip design company is preferred.

上海艾为电子技术股份有限公司（以下简称：“艾为”或“公司”）成立于2008年6月，是一家专注于高品质数模混合信号、模拟、射频的集成电路设计企业，主营业务为集成电路芯片研发和销售。

公司主要产品包括音频功放芯片、电源管理芯片、射频前端芯片、马达驱动芯片等，产品型号达到400余款，可广泛应用于以智能手机为代表的新智能硬件领域，主要细分市场还包括以智能手表和蓝牙耳机为代表的可穿戴设备，以平板和笔记本电脑为代表的智能便携设备，以IOT模块和智能音箱为代表的物联网设备及其他智能硬件等。

公司已成为国内智能手机中数模混合信号、模拟、射频芯片产品的主要供应商之一。