上海招聘

Taking ownership on the total package Failure Analysis. Being a main contact for all the reliability testing for ECP development, NPI builds and HVM, the related FA and report preparation. Integrate and optimize internal & external FA tools and capabilities including but not limited to:

  -        Functional e-tests and component analysis

  -        Ion milling analysis

  -        More detailed and comprehensive analysis on the warpage for assembled packages

  -        Shadow Moire tests

  -        Pre-solder paste height, co-planarity, voiding

   -        Usage of SAM / 3D X-ray for FA Analyze routinely and new FA modes of ECP and total package.

Analyze data to find commonalities of defective and non-defective product Create and constantly improve FA/Reliability tools, documentations (defect catalogues, guidelines, analysis procedures and workflows, templates) and ensure their correct application Provide conclusion based on FA/Rel test and established procedures. Work closely with multiple functions in the organization Collect and organize the FA/Rel analysis know how Plan and organize the implementation of FA/Rel analysis strategies Build long term cooperation with Universities and institutes Other Job assignment from superior

职位要求：

  

• Master's or a Bachelor's degree in Electrical, Electronics, or Microelectronics

• Minimum 5 years’ experience in FA work at OSAT or CM companies.

• Extensive understanding of different FA methods including (but not limited to): functional e-test, SAM, CS, Ion Milling, FIB, X-ray scanning, TDR / Network analyzer, Unit level warpage, Shadow Moire, solder paste height.

• Ability to read CAM design data, net lists of printed circuit boards & ECP

• Basic understanding of the PCB/substrate process, SMT process and packaging molding processes

• Good skills in statistical SW such as Minitab/JMP. Good understanding on Six Sigma methodology. Green/Black belt preferred.

• Ability to plan, organize, and implement multiple concurrent tasks

• Able to perform under deadline pressure

• Good skills in report preparation.

• Excellent verbal and written communication skills

• Good English language skill.

                      

    

奥地利科技与系统技术股份公司(简称：奥特斯)是全球领先的高端印制电路板制造商，特别是在高端HDI微孔互联印制电路板领域，奥特斯拥有全球领先的技术与市场地位，其产品主要应用于移动设备，还广泛涉及汽车、工业、医疗电子领域。
作为一家迅速发展的跨国企业，奥特斯目前在奥地利本土和亚洲地区共拥有六个生产基地 - 奥地利：利奥本、菲岭；亚洲：印度南燕古德、韩国安山、中国上海、中国重庆(在建)。
奥特斯在中国已有十余年的发展历史。奥特斯（中国）有限公司是集团在中国设立的独资企业，项目于2001年由两国***元首在北京人民大会堂共同签署，截至目前累计总投资超过7亿美元，是迄今为止奥地利在华大的投资项目。公司的主要产品为HDI 高端印刷电路板，客户包括了许多全球领先的移动通讯设备厂商。奥特斯上海工厂现有员工超过4300人，根据中国印制电路协会统计，奥特斯上海工厂已发展成为全球大的HDI 高密度印制电路板制造基地。
奥特斯科技（重庆）有限公司是奥特斯集团在中国设立的第二家独资企业，项目于2011年3月启动，工厂将分三期建设，一期投资为4.47亿美元，预计2016年1月开始量产, 届时员工人数将达到1700人。奥特斯（重庆）有限公司生产的产品为高端半导体封装载板，客户为全球领先的半导体制造商。由于半导体封装载板的准入门槛极高，工厂建成后奥特斯将凭借极具竞争力的自身优势跃为全球仅有的三家、中国***的新一代高端半导体封装载板制造商。