上海招聘

Roles and Responsibilities:

- Interface with external foundry and internal design/Operation/PMO/Sales groups;

-Study design manual from different foundry& node, can base on device/GDS list to calculate mask quantity.

- Handle tape out activities without delay and mistake, do job view, define corner split, review WAT.

-Support internal Design/ Sales/Purcharse team to do new Fab and New process survey for pre sales cases.

-Working with internal Engineer team resolve wafer manufacturing technical issues, yield improvement.

-Working with internal Design and Foundry to do PDK/Library/Foundry IP application and download.

-Working with internal logistic team to handle planning, manufacturing and shipping issue.

-Hold periodic meeting with foundry for technical topics. Arrange QBR/QTR.

-Support internal QA team solve foundry related quality problems, attend foundry audit.

 

Qualification Requirement:

- Degree of Bachelor or above in engineering field, major in EE is preferred

- At least 5 years' work experience, and minimum 2 years' foundry Process/Device working experience; 65/55/40/28/14/10/7nm or below & tape out experience is a plus.
- Strong background in processes (<0.18um, FinFET etc), include flow, design rule analysis and validation;
- Able to correlate yield to inline and electrical parameters, and good data analysis ability;
- Self motivated, strong communication and interpersonal skills;

- Must be carefully and take responsibility.

-Ability to multiplex between a variety of different tasks, good Problem Solving and task Management Skills

芯原股份有限公司（芯原）是一家芯片设计平台即服务（Silicon Platform as a Service，SiPaaS™）提供商，为包含移动互联设备、数据中心、物联网（IoT）、可穿戴设备、智能家居和汽车电子等多种终端市场在内的各种广泛应用提供以IP为中心的、基于平台的芯片定制服务和一站式端到端的半导体设计服务。

芯原的SiPaaS解决方案可缩短设计周期、提高产品质量和降低风险。宽泛和灵活的SiPaaS解决方案为包含新兴和成熟半导体厂商、原始设备制造商（OEMs）、原始设计制造商（ODMs），以及大型互联网平台提供商在内的各种客户类型提供极具吸引力的半导体产品替代解决方案。

芯原的芯片平台包括可授权的Vivante GPU核和视觉图像处理器，基于ZSP®（数字信号处理器核）的高清音频、高清语音平台和多频多模无线平台， Hantro高清视频平台，可穿戴设备平台，物联网（IoT）平台，面向语音、手势和触摸界面的混合信号自然用户界面（NUI）平台。芯原的一站式芯片定制服务所涵盖的内容包括：面向一系列宽泛的工艺制程节点（含28nm和22nm FD-SOI、FinFET等先进工艺节点），结合自身技术解决方案和增值的混合信号IP组合所提供的设计服务，以及为系统级芯片（SoC）和系统级封装（SiP）所提供的产品设计及工程服务。

芯原成立于2001年，总部位于中国上海。