上海招聘

Responsibilities:
Function mainly covers Planning, Production Control, Delivery, Internal Customer Service and others.
Planning:
*Receive/Clarify field's or internal engineering department's request on detailed Subcon Service to be performed.
*Co-Work with Operation/Technical Support team to find suitable vendors to meet field's or internal engineering department's request.
*Plan smooth turnkey flow & schedule for each project. Try to meet internal/outside customers' demand.
*Find appropriate capacity at vendors.
*Book adequate allocation at vendors.
*Place order/work order to vendors.
Production Control:
*Maintain good relationship with vendors.
*Secure reasonable delivery schedule from vendors, once order accepted by vendor.
*Closely monitor WIP. Push to pull in the schedule if needed.
*Highlight any failure / excursion to field/engineering/Operation (technical support team). Closely monitor and drive above teams together with vendor to solve failure/excursion.
*Operate SAP ERP system; correctly maintain WIP status in ERP system.
Delivery:
*Find qualified delivery company to meet project requirement.
*Prepare/Watch out delivery from vendor to vendor, vendor to customer.
*Support custom clearance if needed.
*Issue shipping documents for each delivery.
*Qualify/Manage warehouse for some inventory keeping.
Internal customer service:
*Keep timely communication with field/internal engineering department for the turnkey status and schedule.
Others:
*Support field/internal engineering team for cost estimation (delivery/logistics charge), schedule estimation.
*Support Finance team at payment (to vendor), Invoice (to customer), etc.
Requirements:
*With 3+ relevant working experience
*Experience in IC industry is preferred

芯原股份有限公司（芯原）是一家芯片设计平台即服务（Silicon Platform as a Service，SiPaaS™）提供商，为包含移动互联设备、数据中心、物联网（IoT）、可穿戴设备、智能家居和汽车电子等多种终端市场在内的各种广泛应用提供以IP为中心的、基于平台的芯片定制服务和一站式端到端的半导体设计服务。

芯原的SiPaaS解决方案可缩短设计周期、提高产品质量和降低风险。宽泛和灵活的SiPaaS解决方案为包含新兴和成熟半导体厂商、原始设备制造商（OEMs）、原始设计制造商（ODMs），以及大型互联网平台提供商在内的各种客户类型提供极具吸引力的半导体产品替代解决方案。

芯原的芯片平台包括可授权的Vivante GPU核和视觉图像处理器，基于ZSP®（数字信号处理器核）的高清音频、高清语音平台和多频多模无线平台， Hantro高清视频平台，可穿戴设备平台，物联网（IoT）平台，面向语音、手势和触摸界面的混合信号自然用户界面（NUI）平台。芯原的一站式芯片定制服务所涵盖的内容包括：面向一系列宽泛的工艺制程节点（含28nm和22nm FD-SOI、FinFET等先进工艺节点），结合自身技术解决方案和增值的混合信号IP组合所提供的设计服务，以及为系统级芯片（SoC）和系统级封装（SiP）所提供的产品设计及工程服务。

芯原成立于2001年，总部位于中国上海。