上海招聘

Job Function

    

Candidate will be responsible for driving yield and performance improvements of advanced mix-signal products with wafer foundry partners during all phase of product life cycle including process development, production ramp, and high-volume manufacturing. Also will be responsible for new tape out by collaborating closely with internal design team and interface with foundry customer service team.

    

Responsibilities

1. Fully take charge of new tape out.
2. Analyze yield, process, diagnostic, design, and semiconductor test data to ramp new process nodes, drive baseline yield improvement, and isolate root causes of yield loss and product performance degradation.
3. Forecast future product yields using yield modeling and analysis for new products on future nodes and existing nodes.
4. Collaborate with wafer foundries, and Credo test and design teams to isolate root causes of yield loss and drive improvements.
5. Develop advanced data mining, heuristics, and yield analysis capabilities and tools required for yield debugging.
6. Drive standardization and adoption of new improvements with operation team member.
7. Interface with management and business teams to provide yield outlook for product planning and cost analysis.
8. Lead task forces to address and drive resolution of wafer yield excursions.

                                    

Basic Qualifications

    

Minimum 1 years experience in process integration, device engineering, and/or process development. Hands-on work experience as a process, integration, yield, or technology development engineer in wafer fab is a must. Knowledge of device physics, reliability failure mechanisms, and chemistry/physics of wafer fabrication processes are also required. Knowledge and practical use of statistical methods including SPC, DOE, and RSM, and statistical or yield analysis software such as JMP, DataPOWER, or Minitab is a plus.

    

Education Requirements

    

Bachelor or above in Electrical Engineering, Physics, Materials Science, or related discipline required.

CREDO成立于2008年，是全球领先的半导体芯片设计公司，在上海、硅谷、香港、新竹、武汉、南京均设有分支机构。CREDO多年来致力于为数据中心、云、5G、超级计算等领域提供低成本、低功耗、最先进的超高速单通道112G/56G/28G连接商业解决方案，是全球屈指可数能在28nm/16nm/12nm/7nm全部工艺基础上实现400G/800G连接商业解决方案的公司，产品满足客户对成本、功耗、性能、上市时间、产能等多方位要求。
CREDO在主要产品及服务包括：Optical DSP、Linecard IC、AEC（有源电缆）、IP，深受国内外客户认可；服务的客户及产业合作伙伴包括但不限于国内外一流交换芯片 、 交换机 、通讯设备 、 测试仪表 、 光模块 、 超级计算等厂商。
随着公司发展，CREDO在行业的影响力日趋增长：曾获2017、2019年度台积电（TSMC）开放创新平台专业IP技术奖。公司是OCP成员企业，参与 IEEE 、 OIF 等标准的制定，也是HiWire 全球产业联盟发起人。HiWire 全球产业联盟是支持HiWire AEC（有源电缆）应用与发展的非营利组织，旨在促进高质量、可兼容的HiWire有源电缆AEC设备开发，建立HiWire AEC从研发、生产、测试到使用的行业生态系统，提高公众认知并激发终端用户对HiWire AEC使用需求。
CREDO集团目前在国内下设两家子公司：默升科技，为集团全球研发中心；芯境科技，取“芯”无止境之意，致力于为中国客户提供更及时周到的售前与售后服务，以支持中国系统厂商的快速发展。
CREDO已于2020年上半年完成来自国内外投资人的D轮融资，未来发展势头强劲。CREDO坚持“技术领先，以人为本”的经营理念，始终关注雇员健康与个人发展，欢迎海内外各类人才踊跃加入，与公司共同成长。