胶粘剂销售经理
上海熙邦应用材料有限公司
- 公司规模:50-150人
- 公司性质:民营公司
- 公司行业:电子技术/半导体/集成电路
职位信息
- 发布日期:2019-04-05
- 工作地点:上海-奉贤区
- 招聘人数:2人
- 工作经验:3-4年经验
- 学历要求:大专
- 职位月薪:0.8-1万/月
- 职位类别:销售经理
职位描述
1.负责公司粘剂的销售及推广,负责客户关系管理,完成公司制定的销售目标;
2.熟悉以下一个或多个行业:光通讯市场粘接剂;电子行业胶粘剂市场;底部填充(underfill)LED固晶胶,导电胶;
3.开拓新市场,发展新客户,增加产品的销售范围;
4.负责辖区市场的收集及竞争对手的分析;
5.与客户保持良好的沟通,实时把握客户需求,为客户提供主动,热情,满意,周到的服务。
任职要求:
1.热爱销售工作,本科或以上学历;
2.有较强的责任心,敬业精神,具有良好的职业素养,务实,能吃苦耐劳;
3.有开拓精神和良好的人际沟通技能;
4、抗压能力强,适应出差。
我们将提供一个优异的平台,通过底薪加高提成和广阔的发展平台帮优秀的你实现“薪”中所想!
公司介绍
上海熙邦是一家专注于研发生产高端电子、光通讯用粘接与密封剂的高科技公司。公司在上海综合开发区设立研发、生产与营销中心,并在深圳和成都设立办事处。产品辐射全国并服务于国内多个行业的客户群体。为微电子、军工、航空航天和光通讯等领域提供成套的专业解决方案;特别在光通讯粘接剂行业开拓性开发系列单组份粘接剂。
公司通过与国外团队的多年来合作,掌握微电子与光通讯粘接剂国际前沿技术;建立完善的研发与质量控制体系;拥有快速响应和满足客户特殊定制需求的能力;提供完善的售前与售后技术支持的服务;为用户的产品稳定运行保驾护航。
SUP-BOND产品系列由环氧树脂,丙烯酸酯混合配方组成。提供可在室温、加热或紫外光下固化的单组份和双组分产品体系。
Shanghai SupBond is a high-tech company focus on research and production of high performance adhesives and sealants for electronic and optical communication industries. SupBond headquarter, R/D laboratories and Production are set up in “Shanghai Comprehensive Development Zone”. We also have offices in Shenzhen and Chengdu.
SupBond provides complete bonding solutions for microelectronics, military, aerospace and optical communication industries. Our newly developed a series of single-component adhesives is especially developed for the OEMs in the electronics and optical industries.
Through many years on the researches and cooperation with our customers, SupBond masters many cutting-edge technologies of adhesives. Our R&D provides customer formulation quickly. Our Production and QC provide stable and qualified products. Our Technical Service provides trouble shoot and other support.
The SUP-BOND product line consists of ambient and heat cure and UV curable and UV/heat combination cure adhesives. We also provided customer special formulations.
公司通过与国外团队的多年来合作,掌握微电子与光通讯粘接剂国际前沿技术;建立完善的研发与质量控制体系;拥有快速响应和满足客户特殊定制需求的能力;提供完善的售前与售后技术支持的服务;为用户的产品稳定运行保驾护航。
SUP-BOND产品系列由环氧树脂,丙烯酸酯混合配方组成。提供可在室温、加热或紫外光下固化的单组份和双组分产品体系。
Shanghai SupBond is a high-tech company focus on research and production of high performance adhesives and sealants for electronic and optical communication industries. SupBond headquarter, R/D laboratories and Production are set up in “Shanghai Comprehensive Development Zone”. We also have offices in Shenzhen and Chengdu.
SupBond provides complete bonding solutions for microelectronics, military, aerospace and optical communication industries. Our newly developed a series of single-component adhesives is especially developed for the OEMs in the electronics and optical industries.
Through many years on the researches and cooperation with our customers, SupBond masters many cutting-edge technologies of adhesives. Our R&D provides customer formulation quickly. Our Production and QC provide stable and qualified products. Our Technical Service provides trouble shoot and other support.
The SUP-BOND product line consists of ambient and heat cure and UV curable and UV/heat combination cure adhesives. We also provided customer special formulations.
联系方式
- 公司地址:地址:span南桥环城东路312号