上海招聘

Responsibilities:
1.To qualify bumping/assembly subcontractors for SMIC turnkey business.
2.Ensure successful New Product Introduction to bumping / assembly subcontractors.
3.On-going monitor bumping/assembly subcontractors'quality performance,in terms of yield,KPI,and defect pareto.
4.On-going monitor bumping / assembly subcontractors' reliability performance.
5.Manage bumping / assembly subcontractors' engineering change to minimize the risk on SMIC's product.
6.Work with bumping / assembly subcontractors on process excursion to appropriately identify root cause and take effective corrective & preventive actions accordingly.
7.Manage maverick lot to eliminate suspected material escaping to customer.
8.Report to customer on turnkey quality regularly.
9.Setup new bumping / assembly process at subcontractors to support launch of SMIC newly developed wafer technologies.

Requirements:
1.Bachelor or above in semiconductor physics, material science, chemical, or EE.
2.Good experience in semiconductor manufacturing process. Familiar with foundry BEOL process is preferred.
3.Good English speaking and writing.
4.Good at use of quality tools, such as QC 7 tools, SPC, comparison analysis, and MSA, etc.
5.Familiar with quality system requirements.
6.Willing to travel.

中芯国际集成电路制造有限公司（“中芯国际”，纽交所代号：SMI，港交所股份代号：981），是世界领先的集成电路晶圆代工企业之一,也是中国内地技术***面、配套最完善、规模***、跨国经营的集成电路制造企业，提供0.35微米到28纳米不同技术节点的晶圆代工与技术服务。中芯国际总部位于上海，拥有全球化的制造和服务基地。 在上海建有一座300***晶圆厂和一座200***晶圆厂；在北京建有一座300***晶圆厂和一座控股的300***先进制程晶圆厂；在天津和深圳各建有一座200***晶圆厂；在江阴有一座控股的300***凸块加工合资厂；在意大利有一座控股的200***晶圆厂。中芯国际还在美国、欧洲、日本和中国台湾地区设立行销办事处、提供客户服务，同时在香港设立了代表处。详细资讯请参考中芯国际网站*************。