上海招聘

Job Description: 

• Work closely with Hardware Engineer to make concept mechanical design based on Power Flow and Coolant Flow.
• Make detailed 2D / 3D design of OBC including die casting / stamping / plastic parts
• Integrate HV / LV Connectors / cables / busbars into OBC.
• Determine the structure of magnetics, determine the connections between magnetics and PCBA.
• Work with Thermal Engineer to make thermal design of OBC. Support Thermal Engineer to conduct thermal simulation; Select proper thermal material.
• Work with FEA Engineer to conduct FEA simulations (including vibration and mechanical shock and so on.)
• Study tolerance stack-up and work on DFM with supplier.
• Support Hardware Engineer to conduct validations of OBC
• Work closely with supplier to solve production issues (especially for die casting defects).
• Support global team accordingly.

Qualification:

• Bachelor’s degree in Mechanical Engineering or above.
• Experienced in Power Electronics Package Design. Skilled in CATIA or UG.
• Be very familiar with die casting process and machining process; Being familiar with stir welding process will be a plus
• Be familiar with thermal material. Excellent theory knowledge of thermal theory and material strength, including calculation and simulation skills, Experienced in Thermal simulation or FEA will be a plus.
• Good knowledge of tolerance stack-up. Understanding GD&T is a must. Understand the assembly process of power electronic products.
• Good knowledge of DFM (Design for manufacture) and DFA (Design for Assembly)
• Experienced in design validations of power electronics.
• Good written and oral English skills to work with global team.

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