硬件应用工程师/Hardware Application Engineer
Sytrons Technology Co.,Ltd. 思信电子科技有限公司
- 公司规模:150-500人
- 公司性质:合资
- 公司行业:电子技术/半导体/集成电路
职位信息
- 发布日期:2019-07-07
- 工作地点:上海-浦东新区
- 招聘人数:若干人
- 工作经验:无工作经验
- 学历要求:本科
- 职位月薪:1.5-2万/月
- 职位类别:集成电路IC设计/应用工程师
职位描述
Junior/Senior Hardware Application Engineer
Job Descriptions
1. Augment our customer solutions with technical collateral, such as application note documentation, user guide on customization and tuning, sample/reference design materials and debugging/profiling tools, FAE and customer trainings to enable easy productization of customer systems
2. Train and enable ecosystem partners with critical knowledge of our customer's technologies and platforms and drive best practices to reduce time-to-revenue and scale business
3. Provide product and technology influential feedback into Enterprise product management, Enterprise Systems and SW efforts, and our customer technology and product planning
4. Build and drive engineering relationship with different domain subject matter experts in HW development, Power Performance Debugging, Silicon debug etc. in other R&D and BU teams and put together a model of expertise sharing in a collaborative model.
5. Provide business critical engineering enablement for business development and sales engagements to enable design win expansion
6. Engage directly in hands-on work on key technical topics/issues, architecture discussions and performance optimizations with customers and internal teams and steering of multi-party discussion to convergence
Requirements
1. Engineering degree in CS or EE with 2+ years of relevant experience
2. Strong technical skills with extensive hands-on background in design, architecture and debugging, Schematics, PCB design, EMI and Signal Integrity analysis, SW architecture and development, use-case analysis, performance optimization, system architecture etc
3. Good familiarity with Windows, Linux and Android operating systems, High-Speed IO, MM and Graphics concepts
4. Experience in working directly with global customers and enabling them into production while multi-tasking and handling pressure well
5. Strong willingness and adaptability to rolling-up-the-sleeves and playing different roles ranging from individual contributor to program manager for critical project efforts and business needs
6. Team player with passion and zeal to do whatever it takes for business success with a keen sense of urgency and strong drive
7. Excellent communication and evangelizing skills with an entrepreneurial spirit to drive team results.
Preferred Skill and Experience
1. Engineering degree (EE / CS) with 1-3 years of relevant professional experience.
2. Demonstrated successful experience in electronic engineering within a product design and manufacturing environment. Also requires effective communication skills.
3. Customer facing skills a requirement.
职能类别: 集成电路IC设计/应用工程师
公司介绍
随着公司迅速发展,现已在美国、上海设立了分部,致力于IP研发与设计、IP解决方案、客户IP/SOC芯片的定制、本公司自身SOC芯片开发及产业化; 以及人才复兴计划等业务发扬光大,开疆辟土。
短短9年时间,本公司己有长期稳定的供应商与合作客户均为世界前10名最***著名半导体设计公司如高通、博通Broadcom、AMD、GF等等, 及国内外龙头或上市半导体公司如SYNOPSYS、ADI、ALchip、国民技术等等优秀半导体公司。并且与这些供应商进行全方位合作技术包括研讨、研发与设计. 现已在上海、美国建立办事处,扩大业务规模,壮大技术团队。
目前已完成世界上最前沿的项目及工艺制层:40/28/20/16/14/10/7/5nm.? 并且完成多个领域IP核技术和芯片及产品开发与设计如DAB、DVB-C、DVB-T、蓝牙、物联网IoT、人工智能AI等等系列IP核技术与芯片。
与此同时也取得很多技术突破,拥有多项专利和IP核技术,并获得广东省高新技术企业荣誉称号及列入国家支持企业之列。
主要商业模式:本公司采取独特的市场策略,有效组合,提升了本公司技术的竞争性, 本公司商业模式定位为以下三种方式组合:
1.提供IP核,IP核授权费(License Fee)和IP版税(Royalty);
2.以IP及IP核心技术为基础,根据客户的需求设计与定制各类IP、SOC芯片。提供ASIC、SOC所谓Spec-in 整体设计技术与解决方案,并与客户共同开发芯片及产品。
3.根据市场导向,结合自身IP及IP核心技术,设计与研发本公司SOC芯片和产品,实现自身芯片产业化。
联系方式
- 公司地址:中关村软件园