上海招聘

Job Description:

1. Lead an engineering team (60 to 70 engineers) to perform process and product 

qualifications for Lead Frame Type、PBGA packages

2. Work with Station & Manufactory PE team to implement new processes and products into production line

3. Work with customer to understand the customer requirements and to implement

them in the process

4. Take in charge of conducting process evaluations and preparing reports including,

FMEA, DOE

(process windows), failure analysis and process specs. 5. Take in charge of

engineering supports for Production sustaining.

5. Strong experience should be in the areas of Molding, laser scribing and laser

marking for SiP packages.

Qualification:

【Education Background】

1. BS degree or above in related engineering majors

2. Excellent interpersonal and communications skills in both Chinese & English

【Working Experiences】

1. 10 to 15 year experience in electronic packaging, engineering and manufacturing management.

2. Packaging back-end experiences are required, such as molding, laser marking / trimming / singulation, experience in SMT is a plus.

3. Experiences to work with English speaking customers.

【Requirements】

1. Project Management Skill,

2. communications skills in both Chinese & English

3. Strong multi-task skills and detail oriented

4. Able to work under pressure and complex

日月光集团为全球***半导体制造服务公司，自1984年起即提供包括芯片前段测试及晶圆针测至后段之封装、材料及成品测试的一元化服务，以及集团中的环隆电子(USI)，提供完善的电子制造服务整体解决方案。
我们专注于运用我们先进封装、材料、及测试技术，在半导体制程每个阶段皆提供附加价值给全球客户。
身为全球电子供应链中不可或缺的环节，日月光在全球各地有制造据点，现有超过六万八千名员工。
日月光专注投入做为客户的虚拟工厂，以务实勤奋的精神提供猷如客户团队延伸的服务。
日月光集团的全球营运据点包括中国台湾、中国、南韩、日本、马来西亚、新加坡等地。除此之外，我们在美国与欧洲设立业务办公室，日月光将近70%集团营收来自于这两个地区。
日月光的全球策略性营运服务平均分布于3C市场的客户群，使日月光成为全球半导体产业的知名企业