上海招聘

职位描述：
Responsibilities:
1. Critical member of Finisar’s Global DFM Engineering team. Share in the generation of rigid or flex PCB stackups including all impedance calculations, material specifications, drill parameters, etc. for the LSR
2. Answering Technical Questions (TQ’s) for designs from Shanghai, WUXI, IPOH, and Singapore, with the Finisar road map for organic substrates in mind. Occasional backup during the absence of other team members
3. Execute the Supplier Notice (SN) process within Agile within a timely manner for job continuity and efficiency
4. Work closely with PCB Fabricators, Design Engineers, Layout Engineers, & the DFM team to close out issues
5. Participate in the PCB and Flex technology road mapping team, research options for next steps, etc.
6. Research PCB/FLEX technology for next-generation organic substrate development
Qualification:
1. Excellent communication skills with Fabricators, Design Engineers, Layout Engineers, & the DFM team to quickly close out issues
2. In Depth Knowledge of the fabrication process of Rigid & Flex PCB Circuits (Lay-up, Lamination, Mechanical and Laser Drilling, Plating, etc.)
3. In Depth knowledge of High Density Interconnect (HDI) and its associated design rules.
4. Ability to derive a balanced design to satisfy manufacturability and project goals such as performance & density
5. Proficient in the Agile revision control, supplier notice, and release process
6. Familiar with PCB and Flex technology dielectric materials, adhesives and process options such as Subtractive Plating, Semi-Additive Plating, via options such as ALIVH, ELIC, Sintering, Surface Finishes, etc.) 举报 分享

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