上海招聘

职位描述：
Description
As the team member of Credo Technology(SH) Operation team, responsible for the package process engineering but not limited, need involve in new package solution for Credo cutting edge SerDes products as well package cost analysis especially for package selection justification to BU/Sales at design win stage. Back to the major filed, coordinate all package activities in Credo’s oversea subcons, such as to lead the new package design technical review in package house with package designer, budget NRE and Unit Price quotation negotiation.Take charge of all package process trouble shooting and resolving especially expertized in high advanced fcCSP/FCBGA package technology platform, handle the low yield case of MP and continuously improvement. Furthermore, assist with Product Engineer to build up/maintain package engineering segments of product database.

Qualifications
- Good command of written and spoken English
- Eager to learn, good interpersonal and communication skill
- Had ever been a process engineering at flip chip CSP/BGA line is a must, and flip chip bond process engineer is a good plus
- Experienced on PFMEA
- Knowledge of basic package design especially on fcCSP/FCBGA
- Familiar with the whole package process flow of fcCSP/FCBGA is a plus
- Learn Statistics and statistical data analysis especially for high volume data operation.
Education Requirements
Required: Bachelor's or above, Mechanical, Material, Electronics or other related Engineering 举报 分享

CREDO成立于2008年，是全球领先的半导体芯片设计公司，在上海、硅谷、香港、新竹、武汉、南京均设有分支机构。CREDO多年来致力于为数据中心、云、5G、超级计算等领域提供低成本、低功耗、最先进的超高速单通道112G/56G/28G连接商业解决方案，是全球屈指可数能在28nm/16nm/12nm/7nm全部工艺基础上实现400G/800G连接商业解决方案的公司，产品满足客户对成本、功耗、性能、上市时间、产能等多方位要求。
CREDO在主要产品及服务包括：Optical DSP、Linecard IC、AEC（有源电缆）、IP，深受国内外客户认可；服务的客户及产业合作伙伴包括但不限于国内外一流交换芯片 、 交换机 、通讯设备 、 测试仪表 、 光模块 、 超级计算等厂商。
随着公司发展，CREDO在行业的影响力日趋增长：曾获2017、2019年度台积电（TSMC）开放创新平台专业IP技术奖。公司是OCP成员企业，参与 IEEE 、 OIF 等标准的制定，也是HiWire 全球产业联盟发起人。HiWire 全球产业联盟是支持HiWire AEC（有源电缆）应用与发展的非营利组织，旨在促进高质量、可兼容的HiWire有源电缆AEC设备开发，建立HiWire AEC从研发、生产、测试到使用的行业生态系统，提高公众认知并激发终端用户对HiWire AEC使用需求。
CREDO集团目前在国内下设两家子公司：默升科技，为集团全球研发中心；芯境科技，取“芯”无止境之意，致力于为中国客户提供更及时周到的售前与售后服务，以支持中国系统厂商的快速发展。
CREDO已于2020年上半年完成来自国内外投资人的D轮融资，未来发展势头强劲。CREDO坚持“技术领先，以人为本”的经营理念，始终关注雇员健康与个人发展，欢迎海内外各类人才踊跃加入，与公司共同成长。