上海招聘

职位描述：
Responsibilities:
1、Develop assemble process/manufacture platform for photo-electric components products and package;
2、Focus on die bond, wire bond process and relative manufacture platform including silver epoxy, non-conductive epoxy, UV glue bond and wire etc. process
3、Prepare and update the process engineering documents such as process-flow chart, PFMEA, work instruction and etc.
Qualifications ：
1、Bachelor Degree or above in Material Engineer, mechanical or related engineering discipline.
2、Minimum 3 years relevant experience in die bond and wire bond process and manufacturing in semiconductor or fiber optics industry
3、Be familiar with SPC, DFMEA/PFMEA, Process Failure Analysis and DOE etc.
4、Design experience for process tooling/fixture using Soldworks or Auto- CAD is preferred
5、Experience in trouble shooting and serving of die/wire bonding machinery/equipments.
6、Good in spoken and written Chinese and English.
7、Good communication, problem solving, interpersonal and analytical skills.
8、Willling to domestic and oversea travel (20%) 举报 分享

II-VI公司是全球领先的工程材料和光电子器件制造商。作为一家垂直一体化的公司，其为通信、材料加工、半导体材料设备、生命科学、消费电子和汽车等市场开发多样化应用的创新产品。公司总部位于美国宾夕法尼亚州萨克森堡，在全球拥有研发、制造、销售、服务和分销等中心。该公司生产各种特定用途的光子和电子材料及组件，并以各种形式有效利用它们，包括集成先进的软件来支持我们的客户。II-VI高意研发中心遍布全球多个城市，其中芯片的研发和生产主要位于美国、英国、瑞士等。半导体激光器在瑞士和英国都有研发中心；光收发模块的研发中心主要在美国Fremont和中国上海；其他光器件产品以及光学平台的研发则主要在中国上海和福州。