Process Engineer-die attach/wire bond 工艺工程师
菲尼萨光电通讯(上海)有限公司
- 公司规模:500-1000人
- 公司性质:外资(欧美)
- 公司行业:通信/电信/网络设备
职位信息
- 发布日期:2016-12-03
- 工作地点:无锡
- 招聘人数:1人
- 工作经验:3-4年经验
- 学历要求:本科
- 语言要求:英语 良好
- 职位类别:半导体技术 工艺工程师
职位描述
职位描述:
KEY JOB DUTIES & RESPONSIBILITIES:
1.Improve and maintain die attach, wire bond process for OSA product
2.Responsible for yield improvement, HPU improvement and cost saving
3.Responsible for process work instruction maintain and update
4.New equipment setup and buyoff, new fixture design and buyoff
5.FA for abnormal product and RMA process related product
6.Train technicians and operators
7.New product , new process introduce to production
8.SPC and FMEA maintain and update
SKILLS/QUALIFICATIONS (include Education, Skills & Experience): Finisar is an Equal Opportunity Employer.
1.Bachelor degree or above in Optics, Electronics, Mechanics and Physical, Material engineering
2. Over 3 years working experience of process engineering, familiar with die attach, wire bond machine maintenance ,Operation experience of KNS/HNK/MRSI/Datacon is preferred
3. 3 years working experience of optical communication, semiconductor, automation, electronics, and related industries,
4.Familiar with quality tools, SPC,DOE, etc,
5.It’s better if familiar with solidworks,Auto CAD
6.Good interpersonal skill, Proactive
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KEY JOB DUTIES & RESPONSIBILITIES:
1.Improve and maintain die attach, wire bond process for OSA product
2.Responsible for yield improvement, HPU improvement and cost saving
3.Responsible for process work instruction maintain and update
4.New equipment setup and buyoff, new fixture design and buyoff
5.FA for abnormal product and RMA process related product
6.Train technicians and operators
7.New product , new process introduce to production
8.SPC and FMEA maintain and update
SKILLS/QUALIFICATIONS (include Education, Skills & Experience): Finisar is an Equal Opportunity Employer.
1.Bachelor degree or above in Optics, Electronics, Mechanics and Physical, Material engineering
2. Over 3 years working experience of process engineering, familiar with die attach, wire bond machine maintenance ,Operation experience of KNS/HNK/MRSI/Datacon is preferred
3. 3 years working experience of optical communication, semiconductor, automation, electronics, and related industries,
4.Familiar with quality tools, SPC,DOE, etc,
5.It’s better if familiar with solidworks,Auto CAD
6.Good interpersonal skill, Proactive
职能类别: 半导体技术 工艺工程师
关键字: die attach wire bond process 工艺
公司介绍
II-VI公司是全球领先的工程材料和光电子器件制造商。作为一家垂直一体化的公司,其为通信、材料加工、半导体材料设备、生命科学、消费电子和汽车等市场开发多样化应用的创新产品。公司总部位于美国宾夕法尼亚州萨克森堡,在全球拥有研发、制造、销售、服务和分销等中心。该公司生产各种特定用途的光子和电子材料及组件,并以各种形式有效利用它们,包括集成先进的软件来支持我们的客户。II-VI高意研发中心遍布全球多个城市,其中芯片的研发和生产主要位于美国、英国、瑞士等。半导体激光器在瑞士和英国都有研发中心;光收发模块的研发中心主要在美国Fremont和中国上海;其他光器件产品以及光学平台的研发则主要在中国上海和福州。
联系方式
- Email:recruitment@finisar.com
- 公司地址:地址:span陈行公路2168号临港浦江国际科技城内浦江智慧广场11A